Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Rowlands, Michael; Das, Rabindra Nath

doi:10.1109/ectc.2007.373821

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Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Cited by 7 publications

References 6 publications

Manufacture and ultra-high frequency performance of an LCP-based, Z-interconnect, flip-chip package

Manufacture and ultra-high frequency performance of an LCP-based, Z-interconnect, flip-chip package

Influence of carbon, metal-coated polymer, and nano powders on sintering and electrical performance of nano-micro-filled conducting adhesives for z-axis interconnections

Versatile Z-axis interconnection-based coreless technology solutions for next generation packaging

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