Abstract:A simulation study of source module components for use within optical interconnect systems is described. SPICE models of laser diodes, CMOS drivers, and electrical packages are developed and exercised to evaluate overall source module performance. Performance metria for power dissipation, signal latency, wavelength chirp, and signal fidelity are used. The effects of laser diode threshold current, bias condition, and driving current level are determined with respect to these metria. The influence of driver type… Show more
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