Abstract:The growing demand for increased chip performance and stable reliability calls for the development of novel off-chip interconnection and bonding methods that can process good electrical, thermal, and mechanical performance simultaneously as well as superior reliability. A chip bonding method with the concept of “nano-locking” (NL) is proposed: the two surfaces are locked together for electrical interconnection, and the connection is stabilized by a dielectric adhesive filled into nanoscale valleys on the inter… Show more
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