2007 IEEE International Conference on Microelectronic Test Structures 2007
DOI: 10.1109/icmts.2007.374454
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Electrical Failure Analysis Methodology for DRAM of 80nm era and beyond using Nanoprober Technique

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“…Among the applications permitted by this unique capability, it has become standard for the semiconductor industry to evaluate the performance of integrated circuitries (IC) via nanoprobing under electron microscopy imaging [1]. Nanoprobing inside SEM allows needle probes to be precisely positioned on top of sub-micrometer-sized electrodes for direct electrical characterization, which is important for failure analysis, quality control, and process development for the semiconductor industry [2] [3].…”
Section: Introductionmentioning
confidence: 99%
“…Among the applications permitted by this unique capability, it has become standard for the semiconductor industry to evaluate the performance of integrated circuitries (IC) via nanoprobing under electron microscopy imaging [1]. Nanoprobing inside SEM allows needle probes to be precisely positioned on top of sub-micrometer-sized electrodes for direct electrical characterization, which is important for failure analysis, quality control, and process development for the semiconductor industry [2] [3].…”
Section: Introductionmentioning
confidence: 99%