2007
DOI: 10.1016/j.msea.2006.09.109
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Electrical discharge machining of TiNiCr and TiNiZr ternary shape memory alloys

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Cited by 62 publications
(29 citation statements)
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“…As can be seen from Fig. 1, the MRR of Ni 60 Al 24.5 Fe 15.5 alloy is larger than that of Ti 35.5 Ni 49.5 Zr 15 alloy [22] at various pulse durations during the EDM process. This feature is associated with their melting temperature (T ) and thermal conductivity (K T ).…”
Section: The Materials Removal Rate and Surface Roughness Of A Nialfe mentioning
confidence: 84%
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“…As can be seen from Fig. 1, the MRR of Ni 60 Al 24.5 Fe 15.5 alloy is larger than that of Ti 35.5 Ni 49.5 Zr 15 alloy [22] at various pulse durations during the EDM process. This feature is associated with their melting temperature (T ) and thermal conductivity (K T ).…”
Section: The Materials Removal Rate and Surface Roughness Of A Nialfe mentioning
confidence: 84%
“…5 depicts the surface roughness Ra versus the product of the discharge current I P and pulse duration τ P for the Ni 60 Al 24.5 Fe 15.5 alloy. A comparison of roughness Ra values obtained for the Ti 35.5 Ni 49.5 Zr 15 alloy [22] is also shown in Fig. 5.…”
Section: The Materials Removal Rate and Surface Roughness Of A Nialfe mentioning
confidence: 96%
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“…Chen. S. L et.al [8] concentrated the impacts of EDM parameters on surface qualities of a sort of tungsten carbide. They have reasoned that MRR and surface unpleasantness of the work piece are specifically corresponding to the release current power.…”
Section: Literature Reviewmentioning
confidence: 99%
“…Os processos convencionais, mesmo que otimizados, esbarram nos altos custos envolvidos. As LMF de Ni-Ti, por exemplo, são de difícil usinabilidade e proporcionam um desgaste excessivo das ferramentas, e estudos tem relatado que a usinagem via eletroerosão degradam o EMF [4][5][6]. Assim, é importante desenvolver novos métodos de obtenção de componentes e dispositivos a partir de LMF, que infelizmente ainda apresenta aspectos problemáticos na sua preparação, sendo ainda extremamente complexo e dispendioso, principalmente para LMF do sistema Ni-Ti.…”
Section: Introductionunclassified