Electrical Contact at the Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining

Keum, Hohyun; Chung, Hyun‐Joong; Kim, Seok

doi:10.1021/am4021236

Cited by 20 publications

(14 citation statements)

References 39 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…2(c) ) as well as electrical conductance between Au – Au (Inset plot in Fig. 4(d) ) and Au-Si 29 strongly support the device level capabilities of the micro-Lego technique. While the experimentally obtained Q-factor and insertion loss from the microtoroid resonator and the RF MEMS switch presented in this work display their functionalities, they do not outperform their state of the art counterparts.…”

Section: Discussionsupporting

confidence: 53%

Microassembly of Heterogeneous Materials using Transfer Printing and Thermal Processing

Keum

Yang

Han

et al. 2016

Sci Rep

Self Cite

View full text Add to dashboard Cite

Enabling unique architectures and functionalities of microsystems for numerous applications in electronics, photonics and other areas often requires microassembly of separately prepared heterogeneous materials instead of monolithic microfabrication. However, microassembly of dissimilar materials while ensuring high structural integrity has been challenging in the context of deterministic transferring and joining of materials at the microscale where surface adhesion is far more dominant than body weight. Here we present an approach to assembling microsystems with microscale building blocks of four disparate classes of device-grade materials including semiconductors, metals, dielectrics, and polymers. This approach uniquely utilizes reversible adhesion-based transfer printing for material transferring and thermal processing for material joining at the microscale. The interfacial joining characteristics between materials assembled by this approach are systematically investigated upon different joining mechanisms using blister tests. The device level capabilities of this approach are further demonstrated through assembling and testing of a microtoroid resonator and a radio frequency (RF) microelectromechanical systems (MEMS) switch that involve optical and electrical functionalities with mechanical motion. This work opens up a unique route towards 3D heterogeneous material integration to fabricate microsystems.While monolithic microfabrication has been quite successful in the manufacturing of microsystems such as integrated circuits (IC) and microelectromechanical systems (MEMS) 1,2 , continued innovation towards three dimensional (3D) architectures and heterogeneous integration has been limited, which would otherwise enable improvements in performance and novel functionalities of microsystems. Associated challenges originate from layer-by-layer thin film processing on a single substrate and dissimilar nature of materials that may need different techniques to process. Consequently, 3D heterogeneous integration often requires independent fabrication of constituents followed by microassembly rather than monolithic microfabrication. In this context, transfer printing 3,4 has emerged as a method that utilizes highly reversible surface adhesion of a polymeric stamp to deterministically transfer microscale solid objects called "inks". The ability to transfer inks from a donor substrate where inks are grown and processed to a receiving substrate where inks are finally assembled reduces the complexity of manufacturing processes regarding heterogeneous material integration. Furthermore, previously reported micro-masonry 5 which relies on transfer printing demonstrates that after proper thermal processing, direct bonding between transferred silicon inks can be achieved, which may be sufficiently strong to produce various MEMS devices 6-8 . However, limited assembling material classes and quantitatively unknown interfacial characteristics between joined inks suppress broader adaptation of this transfer printing-based microasse...

show abstract

Section: Discussionsupporting

confidence: 53%

Microassembly of Heterogeneous Materials using Transfer Printing and Thermal Processing

Keum

Yang

Han

et al. 2016

Sci Rep

Self Cite

View full text Add to dashboard Cite

show abstract

“…Various such techniques include transfer printing, the trench-protect-release (TPER) based process, double transfer printing, soft-etch-back (SEB), corrugation architecture, silicon-on-insulator (SOI), and laser lift-off process. [21][22][23][24][25][26][27][28][29][30][31][32][33][34][35] The practical advantages of making materials flexible include ability to deploy on a complex and asymmetrical surfaces, enhancing device performance due to excellent and proven conventional superior properties matching with the current state-of-the-art rigid device technologies, in addition to reducing the form factor which implies low weight and low cost due to new and easy fabrication processes. [36,37] Any free-standing material that is less than 100 nm in one of its three spatial dimensions can be inherently flexible and is often termed a nanomaterial.…”

Section: Optimal Materials For Harsh Environmentsmentioning

confidence: 99%

Flexible and Stretchable Electronics for Harsh‐Environmental Applications

Almuslem

Shaikh

Hussain

2019

Adv Materials Technologies

View full text Add to dashboard Cite

Monitoring, measuring and controlling electronic systems in space exploration, automotive industries, downhole oil and gas industries, oceanic environment, geothermal power plants, etc. require materials and processes that can withstand harsh environments. Such harshness can come from the surrounding temperature, varying pressure, intense radiation, reactive chemicals, humidity, salinity, or a combination of any of these conditions. Here, we review recent progress in the development of flexible and stretchable electronic devices for harsh environment applications. We consider studies on how the selection of a specific material is important for a specific application and how the selection of the material plays critical role in sustained performance. We present specific examples for selected applications. We also look at works on methods and designs for achieving flexibility and stretchability in devices designed for harsh environments. Finally, we look at studies on Powered by Editorial Manager® and ProduXion Manager® from Aries Systems Corporation packaging techniques that enable deployment of conventional electronic devices in harsh environment applications and offer a few examples.

show abstract

“…Different ink materials may require different sacrificial layers to be prepared as inks. For example, an Si, SiO 2 , or polymethylmethacrylate (PMMA) sacrificial layer is necessary to make SiO 2 , Au, or SU8 ink, respectively [35,59,60,61,62]. However, for any ink materials, inks are photolithographically patterned with desired shapes and entail relatively low adhesion or joining to donor substrates.…”

Section: Ink Preparationmentioning

confidence: 99%

“…In order to use micro-LEGO-assembled structures within device applications, the electrical contact at the interface between two assembled materials, especially metal–semiconductor or metal–metal interfaces, should be acceptable. First, a transmission line model (TLM) [70,71,72] was adopted to measure the contact resistance of transfer-printed Au inks on Si (Figure 8a) and their ohmic contact characteristics were demonstrated [61]. It was observed that a transfer-printed Au ink on Si exhibits significantly reduced contact resistance when they are thermally processed at or above the bulk eutectic temperature.…”

Section: Joiningmentioning

confidence: 99%

Micro-LEGO for MEMS

Kim

2019

Micromachines

View full text Add to dashboard Cite

The recently developed transfer printing-based microassembly called micro-LEGO has been exploited to enable microelectromechanical systems (MEMS) applications which are difficult to achieve using conventional microfabrication. Micro-LEGO involves transfer printing and thermal processing of prefabricated micro/nanoscale materials to assemble structures and devices in a 3D manner without requiring any wet or vacuum processes. Therefore, it complements existing microfabrication and other micro-assembly methods. In this paper, the process components of micro-LEGO, including transfer printing with polymer stamps, material preparation and joining, are summarized. Moreover, recent progress of micro-LEGO within MEMS applications are reviewed by investigating several example devices which are partially or fully assembled via micro-LEGO.

show abstract

Electrical Contact at the Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining

Cited by 20 publications

References 39 publications

Microassembly of Heterogeneous Materials using Transfer Printing and Thermal Processing

Microassembly of Heterogeneous Materials using Transfer Printing and Thermal Processing

Flexible and Stretchable Electronics for Harsh‐Environmental Applications

Micro-LEGO for MEMS

Contact Info

Product

Resources

About