1987
DOI: 10.1016/0169-4332(87)90099-7
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Electrical conduction in thin thermally nitrided SiO2 (nitroxide)

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Cited by 10 publications
(4 citation statements)
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“…30,31) PF conduction has not been reported for thin film SiO 2 , either deposited or prepared by thermal oxidation of c-Si. However, it has been reported for nitrided SiO 2 , sometimes referred to a ''nitroxide'', 32) supporting the correlation been between PF conduction and the bonding of N in Si 3 N 4 and Si oxynitride alloys. The difference between N 2p to 2p à and O 2p to 2p à final states is correlated with differences in the extent of bond-angle stabilization of the local bonding of O in SiO 2 and N in Si 3 N 4 and in the Si oxynitride alloys as well.…”
Section: Introductionmentioning
confidence: 83%
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“…30,31) PF conduction has not been reported for thin film SiO 2 , either deposited or prepared by thermal oxidation of c-Si. However, it has been reported for nitrided SiO 2 , sometimes referred to a ''nitroxide'', 32) supporting the correlation been between PF conduction and the bonding of N in Si 3 N 4 and Si oxynitride alloys. The difference between N 2p to 2p à and O 2p to 2p à final states is correlated with differences in the extent of bond-angle stabilization of the local bonding of O in SiO 2 and N in Si 3 N 4 and in the Si oxynitride alloys as well.…”
Section: Introductionmentioning
confidence: 83%
“…This provides a ''pathway'' for TAT processes and Poole-Frenkel transport, in Si 3 N 4 and extending to Si oxynitride alloys as well. [30][31][32] The N-atom p to p à transition is also responsible for higher levels of NBTI compared with SiO 2 . 36,37) When the N-content is reduced in Si oxynitride alloys, e.g., 50% SiO 2 and 50% Si 3 N 4 , the NBTI is reduced.…”
Section: Discussionmentioning
confidence: 99%
“…Plasmadeposited silicon nitride is usually formed from the reaction of silane (Sill,) with ammonia, nitrogen, or mixtures of both (1)(2)(3)(4). Plasma-deposited silicon carbide (SiCxHy) films are of interest as window-side layers in amorphous silicon solar cells (5) and as heat-, wear-, and corrosionresistant coatings (6,7). Large stresses that result in poor adhesion or film cracking due to thermal mismatches make low temperature (i.e., plasma) deposition for the latter application attractive.…”
Section: Discussionmentioning
confidence: 99%
“…In our work, the growth process and the electrical properties of the thermally nitrided SiO2 in a pure ammonia ambient have been studied; the results of the latter are discussed elsewhere (6,7). By applying various processing conditions we have obtained different depth profiles of nitrogen mentioned above in the resulting nitrided films.…”
mentioning
confidence: 99%