2021
DOI: 10.1016/j.mee.2021.111618
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Electrical characterization of flexible hafnium oxide capacitors on deformable softening polymer substrate

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Cited by 12 publications
(7 citation statements)
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“…Over the last two decades, hafnium oxide (HfO 2 ) has emerged as a central dielectric material for high κ dielectrics in the semiconductor industry due to its high dielectric permittivity (κ = 16–25), large band gap ( E g = 5.6–5.8 eV), and high thermal stability. In addition, its high hardness, melting point, and refractive index (1.85–2.1), have made hafnium oxide a potential material for applications such as optical devices, ferroelectric transistors and capacitors, transparent protective layers, and biomedical applications such as hard tissue replacement and surgical instruments. , Many of the above technologies require the fabrication of HfO 2 nanoscale structures. These are typically fabricated using conventional top-down approaches, based on photolithography, with high fabrication costs, low throughputs, and complex, EUV-based processes when pattern dimensions below 20 nm are needed. , …”
Section: Introductionmentioning
confidence: 99%
“…Over the last two decades, hafnium oxide (HfO 2 ) has emerged as a central dielectric material for high κ dielectrics in the semiconductor industry due to its high dielectric permittivity (κ = 16–25), large band gap ( E g = 5.6–5.8 eV), and high thermal stability. In addition, its high hardness, melting point, and refractive index (1.85–2.1), have made hafnium oxide a potential material for applications such as optical devices, ferroelectric transistors and capacitors, transparent protective layers, and biomedical applications such as hard tissue replacement and surgical instruments. , Many of the above technologies require the fabrication of HfO 2 nanoscale structures. These are typically fabricated using conventional top-down approaches, based on photolithography, with high fabrication costs, low throughputs, and complex, EUV-based processes when pattern dimensions below 20 nm are needed. , …”
Section: Introductionmentioning
confidence: 99%
“…Consequently, they have been widely used as substrates for neural interfaces and soft electronics. [14,[20][21][22] Implementing the proposed stimulation system on these polymers, not only flexible but also softening and conformable, offers an advantage over conventional rigid silicon technology. In terms of the TFT active material, we utilize amorphous-indium-galliumzinc-oxide (a-IGZO) due to its proven compatibility with thiolene/acrylate polymer substrates.…”
Section: Introductionmentioning
confidence: 99%
“…Among them, hafnium oxide (HfO 2 ) is a versatile material suitable for the next generation of microelectronic devices due to its high dielectric constant (κ ∼ 20) in the monoclinic phase with a band gap of 5.7 eV, high thermodynamic stability, and energy barrier compared to SiO 2 . 18 HfO 2 NPs have been explored in various applications such as capacitors, 19 dielectric barriers, 20 and field effect transistors for sensor applications. 18,21 Furthermore, HfO 2 NPs can be synthesized by different methods such as precipitation, 22 hydrothermal, 23 and ultrasonication processes.…”
Section: Introductionmentioning
confidence: 99%