2018 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) 2018
DOI: 10.1109/ceidp.2018.8544791
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Electrical Characterization of Dibenzyltoluene Liquid at High Temperatures up to 350°C

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Cited by 18 publications
(6 citation statements)
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“…On the other hand, the fact that breakdown voltage of DBT under (quasi) uniform field decreases with temperature [11] seems contradict to the PDIV increase with temperature. This comes from the rather contrast circumstances in both measurements.…”
Section: Discussionmentioning
confidence: 96%
“…On the other hand, the fact that breakdown voltage of DBT under (quasi) uniform field decreases with temperature [11] seems contradict to the PDIV increase with temperature. This comes from the rather contrast circumstances in both measurements.…”
Section: Discussionmentioning
confidence: 96%
“…Four solutions have been proposed for electric field reduction and PD control within envisioned high voltage, compact packaging design of power modules: 1) geometrical techniques [56][57][58][59][60], 2) applying nonlinear field-dependent conductivity (FDC) materials as coatings on high field regions [61] or field-dependent permittivity (FDP) fillers in silicone gel [62], 3) using high-temperature (up to 350°C) insulating liquids as a potential replacement for silicone gels [63][64][65], and 4) combined geometrical techniques and applying nonlinear field-dependent conductivity layers [66][67][68][69][70][71][72].…”
Section: Mitigation Methodsmentioning
confidence: 99%
“…Although the dielectric strength of a high temperature nonpolar dibenzyltoluene (DBT) liquid, Jarytherm® DBT [73], proposed in [63][64][65] as an encapsulant in high-temperature power electronics modules is higher than other dielectric liquids, such as mineral oil or esters at 20 °C, its dielectric strength at 350 °C decreases to about 58% of its initial value at 20 °C. However, PD measurements in [65] shows promising results for these high temperature liquids as an alternative for silicone gel.…”
Section: Mitigation Methodsmentioning
confidence: 99%
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“…Silicone gel is used for encapsulation to prevent in situ electrical discharges in air and to protect substrates, semiconductors and connections against humidity, dirt and vibration. Although alternatives have been researched [6][7][8], silicone gel, which is a weaker insulator than dielectric ceramics and more vulnerable to PDs, is still the only option for encapsulation of WBG power modules. A thorough and in-depth review of PD measurements, failure analyses and control in high-power Si-Insulated-gate bipolar transistor (IGBT) modules has been done in [9,10].…”
Section: Introductionmentioning
confidence: 99%