We investigated the effects of post O 3 feeding treatment and pre-post O 2 plasma treatment on HfO 2 dielectric films in the metal/insulator/metal (MIM) structure TiN/HfO 2 /TiN. The carbon contents of the HfO 2 films decreases with increasing O 3 feeding time, which leads to the improvement in leakage current. The O 2 plasma and O 3 feeding treatments produce Hf-Hf bonds in the bulk HfO 2 film and a Ti oxide layer at the film/bottom electrode and HfO 2 /TiN interface, which prevent the out diffusion of nitrogen into the HfO 2 layer. In addition, these treatments also create the local crystallization of HfO 2 at the interface. In the case of rapid thermal annealing of an actual dynamic random access memory (DRAM) structure, TiN/HfO 2 /Al 2 O 3 /HfO 2 /TiN, a local crystallization is also observed in the HfO 2 layer, which enhances leakage current.