1989
DOI: 10.1049/el:19890466
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Electrical characteristics of oxynitride gate dielectrics prepared by rapid thermal processing of LPCVD SiO2films

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Cited by 3 publications
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“…Some of these properties include better breakdown strength, higher electrical permittivity, improved barrier to impurity diffusion and superior resistance to plasma and radiation damage. These films are being widely employed as masking and passivation layers in microelectronics circuits, in particular in memory cells [1][2][3][4][5] and integrated optical components [6,7].…”
Section: Introductionmentioning
confidence: 99%
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“…Some of these properties include better breakdown strength, higher electrical permittivity, improved barrier to impurity diffusion and superior resistance to plasma and radiation damage. These films are being widely employed as masking and passivation layers in microelectronics circuits, in particular in memory cells [1][2][3][4][5] and integrated optical components [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…Other alternatives to the nitrided oxide process are low-pressure chemical vapour deposition (LPCVD) [12] and plasma-enhanced CVD (PECVD) [13,14]; these processes avoid a high thermal budget which is not compatible with the requirements of advanced submicron device technology. In all these techniques different species are used as gas precursors, but in particular, NH 3 and N 2 O are the most widely employed gases for nitrogen supply. To the best of our knowledge, the electron cyclotron resonance PECVD (ECR-PECVD) deposition technique has scarcely been used to obtain oxynitride films.…”
Section: Introductionmentioning
confidence: 99%