Electrical characteristics of multichip module interconnects with perforated reference planes

Cangellaris, A.C.; Gribbons, M.; Prince, J.L.

doi:10.1109/33.214867

Cited by 29 publications

(5 citation statements)

References 5 publications

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“…Except for the case of abrupt discontinuities, such as multiconductor bends, vertical vias, and multipin connectors, it is often possible to maintain a quasi-TEM behavior on the average. Examples are interconnects with minor nonuniformities like the presence of crossing wires and perforated (mesh) reference planes [65]- [67].…”

Section: A Frequency Range Of Validity Of the Tem Approximationmentioning

confidence: 99%

Progress in the methodologies for the electrical modeling of interconnects and electronic packages

2001

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The rapid growth of the electrical modeling and analysis of the interconnect structure, both at the electronic chip and package level, can be attributed to the increasing importance of the electromagnetic properties of the interconnect circuit on the overall electrical performance of state-of-the-art very large scale integration (VLSI) systems. With switching speeds well below 1 ns in today's gigahertz processors, and VLSI circuit complexity exceeding the 100 million transistors per chip mark, power and signal distribution is characterized by multigigahertz bandwidth pulses propagating through a tightly coupled three-dimensional wiring structure that exhibits resonant behavior at the upper part of the spectrum. Consequently, in addition to the inductive and capacitive coupling, present between adjacent wires across the entire frequency bandwidth, distributed electromagnetic effects, manifested as interconnect-induced delay, reflection, radiation, and long-range nonlocal coupling, become prominent at high frequencies, with a decisive impact of overall system performance. The electromagnetic nature of such high-frequency effects, combined with the geometric complexity of the interconnect structure, make the electrical design of today's performance-driven systems extremely challenging. Its success is heavily dependent on the availability of sophisticated electromagnetic modeling methodologies and computer-aided design tools. This paper presents an overview of the different approaches employed today for the development of an electromagnetic modeling and simulation framework that can effectively tackle the complexity of the interconnect circuit and facilitate its design. In addition to identifying the current state of the art, an assessment is given of the challenges that lie ahead in the signal integrity-driven electrical design of tomorrow's performance-and/or portability-driven, multifunctional ULSI systems.

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Section: A Frequency Range Of Validity Of the Tem Approximationmentioning

confidence: 99%

Progress in the methodologies for the electrical modeling of interconnects and electronic packages

2001

Self Cite

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“…Detailed description of the structure is available in ref. 29. What are needed to be solved are the characteristic impedance and the capacitance of the x-signal line.…”

Section: Simulation Examplesmentioning

confidence: 99%

Three‐dimensional electromagnetic simulation of electronic circuits of general shape

Zheng¹

1994

Int. J. Microw. Mill.‐Wave Comput.‐Aided Eng.

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A general purpose CAD tool, the IE3D electromagnetic simulator is presented in this article. The simulator is based on an integral equation, a method-of-moment formulation for a full-wave solution of three-dimensional (3D) arbitrarily shaped structures in microwave and millimeter-wave integrated circuits (MMIC), high temperature superconductor (HTS) circuits, microstrip antennas, RF printed circuit boards (PCB), and high speed digital circuit packaging. The primary solution of the simulator is the current distribution on a metallic structure in an environment of multilayered substrates on infinitely extended ground plane. The circuit parameters of the structure in either S-parameter form or RLC-SPICE equivalent circuit form is extracted from the solved current distribution. The simulator consists of an MS-Windows-based layout editor, a schematic editor, an electromagnetic simulator, and a post processor. The simulator can perform stand-alone electromagnetic simulation and optimization and mixed electromagnetic and nodal analysis. Simulation results for structures in various high frequency and high speed domains are presented and compared to measured results.

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“…The use of flexible printed circuit boards (FPCBs) in electronic devices has been increasing as these devices become thinner and smaller. Meshed ground planes have been adopted in FPCBs for impedance matching and improved flexibility [1][2][3][4][5][6][7][8]. Apertures of meshed ground planes cause an effective dielectric constant change and a roundabout current path that increase the inductance of the ground plane [9].…”

Section: Introductionmentioning

confidence: 99%

Improving Signal Integrity by Reducing Mode Conversion in Differential Pairs on a Meshed Ground in Flexible Printed Circuit Boards

Kam

2022

J Electromagn Eng Sci

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Asymmetry in a differential pair leads to deterioration of signal integrity. Differential pairs on a meshed ground often encounter asymmetry in return current paths. In this paper, we propose an offset mesh as an improved mesh structure that offsets asymmetry between a solid region and an aperture region. The offset mesh mitigates the asymmetry in the conventional mesh structure without additional design elements. The proposed structure has been verified to be effective in reducing mode conversion, intra-pair and inter-pair skews, and characteristic impedance variation in the time and frequency domains. This enables high-density routing of differential pairs.

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Electrical characteristics of multichip module interconnects with perforated reference planes

Cited by 29 publications

References 5 publications

Progress in the methodologies for the electrical modeling of interconnects and electronic packages

Progress in the methodologies for the electrical modeling of interconnects and electronic packages

Three‐dimensional electromagnetic simulation of electronic circuits of general shape

Improving Signal Integrity by Reducing Mode Conversion in Differential Pairs on a Meshed Ground in Flexible Printed Circuit Boards

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