1957
DOI: 10.1103/physrev.108.1164
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Electrical and Thermal Properties ofBi2Te3

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Cited by 423 publications
(212 citation statements)
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“…The 80°C limit is imposed by severe diffusion of solder material into the TE materials rather than by TE materials themselves. The melting points of TE materials Bi 2 Te 3 , Sb 2 Te 3 , and Bi 2 Se 3 are 585°C [8], 618°C [9], and 706°C [10], respectively. Therefore, to extend the operating temperature to 150°C, solder diffusion at high temperature must be stopped.…”
Section: Introductionmentioning
confidence: 99%
“…The 80°C limit is imposed by severe diffusion of solder material into the TE materials rather than by TE materials themselves. The melting points of TE materials Bi 2 Te 3 , Sb 2 Te 3 , and Bi 2 Se 3 are 585°C [8], 618°C [9], and 706°C [10], respectively. Therefore, to extend the operating temperature to 150°C, solder diffusion at high temperature must be stopped.…”
Section: Introductionmentioning
confidence: 99%
“…These are considered as ultra-low and markedly different from the known inorganic materials such as: TiO 2 13 , Bi 2 Te 3 etc which are in the range of 10-100 W/mK 14 . In fact, the thermal conductivity of MAPbI 3 is closer to that of polymeric materials than those of crystalline structures 15 .…”
mentioning
confidence: 99%
“…Bulk ZT is around 1 [23] As seen in figure 10, comparing the micro to nano graphs it is observed that as CSD decreases the ZT also decreases. This is a direct contradiction to what was expected from the theoretical literature, where it should increase.…”
Section: Zt Vs Csdmentioning
confidence: 58%
“…Bulk thermal conductivity is 5.1 W m -1 K -1 [23]. Thermal conductivity shows a decreases on micro and nano scales.…”
Section: Thermal Conductivity Vs Csdmentioning
confidence: 89%
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