2017
DOI: 10.1088/1757-899x/204/1/012003
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Electrical and Structural Analysis on the Formation of n-type Junction in Germanium

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Cited by 5 publications
(11 citation statements)
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“…Germanium (Ge) is a promising material for replacing silicon as a substrate for metal oxide semiconductor (MOS) devices. Further downscaling of silicon-based devices will lead to the short channel effect (SCE) that will result in an increase in the leakage current [37][38][39]. This leakage current will increase the power consumption of devices, while also reducing the performance.…”
Section: Ge As a Plasmonic Materials In The Mid Infra-redmentioning
confidence: 99%
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“…Germanium (Ge) is a promising material for replacing silicon as a substrate for metal oxide semiconductor (MOS) devices. Further downscaling of silicon-based devices will lead to the short channel effect (SCE) that will result in an increase in the leakage current [37][38][39]. This leakage current will increase the power consumption of devices, while also reducing the performance.…”
Section: Ge As a Plasmonic Materials In The Mid Infra-redmentioning
confidence: 99%
“…High drive current capability of devices without further downscaling process can be realized by increasing the carrier mobility in the substrate. Ge has emerged as one of the potential candidates to replace Si as a substrate for MOS transistors, due to its higher electrical carrier mobility (3900 cm 2 /V·s for electrons and 1900 cm 2 /V·s for holes) [37]. Furthermore, its similarity with conventional Si will ease the replacement process in manufacturing lines.…”
Section: Ge As a Plasmonic Materials In The Mid Infra-redmentioning
confidence: 99%
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