2017
DOI: 10.1016/j.mssp.2016.09.040
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Electrical and optical properties improvement of GeSn layers formed at high temperature under well-controlled Sn migration

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Cited by 17 publications
(15 citation statements)
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“…by rapid thermal annealing, and the films are usually highly strained. 38,39,40 This paper provides insight in the formation mechanism of anisotropic Ge 1−x Sn x structures at temperatures as low as 140 °C leading to a Sn content of 28 %, while the formation of -Sn for this low temperature process is elaborated. Two distinct compositions have been reliably synthesised with two different temperature profiles and pretreatment processes leading to Sn contents of ~17 % and ~28 % and without additional nucleation of branches or substructures.…”
Section: Introductionmentioning
confidence: 97%
“…by rapid thermal annealing, and the films are usually highly strained. 38,39,40 This paper provides insight in the formation mechanism of anisotropic Ge 1−x Sn x structures at temperatures as low as 140 °C leading to a Sn content of 28 %, while the formation of -Sn for this low temperature process is elaborated. Two distinct compositions have been reliably synthesised with two different temperature profiles and pretreatment processes leading to Sn contents of ~17 % and ~28 % and without additional nucleation of branches or substructures.…”
Section: Introductionmentioning
confidence: 97%
“…Recently, there are also some reports on the synthesis of GeSn [21][22][23] and SiGe [20,24,25]. However, there is no experimental report on the synthesis of SnC.…”
Section: Introductionmentioning
confidence: 99%
“…18,22 Therefore, to obtain high quality and direct bandgap GeSn alloy, the dilemma between the Sn segregation at a high growth temperature and the high defect density introduced at a low growth temperature must be overcome. 23 Thermal annealing leads to decrease in defect density and improves optical quality of the GeSn alloy. 24 At the same time, thermal annealing could also increase the portion of substitutional Sn atoms to reduce the difficulty of realizing direct bandgap luminescence.…”
Section: Introductionmentioning
confidence: 99%
“…24,25 Proper annealing temperature has been found to be 500 • C by measuring the root mean square (RMS) roughness and average of aligned yield (from RBS) 26 or 550 • C by using photoluminescence (PL). 23 For a partially relaxed GeSn alloy, the bandgap transition occurs when the Sn concentration is 6∼11%. [1][2][3]27,28 When the GeSn alloy is fully strained on a Ge substrate, the bandgap transformation from the indirect bandgap to the direct bandgap even occurs at 12%.…”
Section: Introductionmentioning
confidence: 99%