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2017
DOI: 10.1007/s10854-017-7609-8
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Electrical and interface properties of PdAl/Au metal alloyed ohmic contacts on p-type GaN for high-temperature MEMS devices

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Cited by 8 publications
(2 citation statements)
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“…4(b). Wahid et al, 40) Su et al, 43) and Puneetha et al 45) also used this method to obtain the barrier height for ohmic contacts to p-GaN. The saturation current density ranges from 5.26 mA at 298 K to 6.92 mA at 400 K. The weak temperature dependence of saturation current density is another indicator that the tunneling current is the main transport mechanism for T141 sample.…”
Section: Resultsmentioning
confidence: 99%
“…4(b). Wahid et al, 40) Su et al, 43) and Puneetha et al 45) also used this method to obtain the barrier height for ohmic contacts to p-GaN. The saturation current density ranges from 5.26 mA at 298 K to 6.92 mA at 400 K. The weak temperature dependence of saturation current density is another indicator that the tunneling current is the main transport mechanism for T141 sample.…”
Section: Resultsmentioning
confidence: 99%
“…Gallium nitride (GaN) has attracted huge research interest due to its potential application in high-frequency, high-power, and optoelectronic devices [1,2]. Its distinctive properties such as wide band gap (∼3.4 eV), high breakdown field strength, and good thermal conductivity have allowed it to be exploited in the development of ultraviolet (UV) photodetectors, lightemitting diodes, metal-oxide-semiconductor field-effect transistors and capacitors, and high-electron-mobility transistors [3][4][5][6][7][8][9]. Metal-semiconductor (MS) Schottky junctions based on GaN have frequently displayed an anomalous leakage current under reverse bias voltages and a low breakdown voltage, resulting in poor device performance, poor thermal stability, and degradation of diode behavior [10][11][12].…”
Section: Introductionmentioning
confidence: 99%