Electric-field Assisted Joining Technology for the Ceramics Materials: Current Status and Development Trend

Abstract

Ceramic materials are widely used in aerospace, medicine and energy transportation concerned for their excellent over-all mechanical and chemical properties, such as corrosion resistance, high temperature resistance and oxidation resistance.Especially, the joining of ceramic materials themselves and connecting with metal is of great significance for the practical engineering applications. Compared with traditional joining technology, electric-assisted joining technology possesses a variety of advantages, such as low temperature and short time, etc. owing to the special influence of the electric field on some ceramic materials. This paper focused on the development of the electric-field assisted joining technologies of ceramics and ceramic matrix composites, and summarized their research statuses in recent years. From the views of joining mechanism, typical interface microstructure and joint strength and influencing factors, the electric-field assisted diffusion bonding (FDB), SPS (Spark plasma sintering) joining, and the new low-temperature rapid flash joining (FJ) were reviewed. Moreover, the applicable scope and limitations of different electric-field assisted joining technologies were expounded. In addition, the development trend of the electric-field assisted joining technology of ceramic materials was prospected.

Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding

“…This process involves adding chemical substances or physical means to improve the performance and workability for better results. Adjusting the composition of the solder material is commonly used for changing the physical and chemical properties of solder and improving mechanical strength (Wang et al , 2020; Chen et al , 2023c), among which the ceramic materials are favored due to their high hardness and strength (Liu et al , 2023), effectively enhancing lead-free solders’ mechanical strength and improving wettability. In addition, the size of ceramic additives has also developed from micrometer level to nanometer level, including nanoparticles and nanowires (NWs).…”