Elasto-viscoplastic nonlocal damage modelling of thermal fatigue in anisotropic lead-free solder

Ubachs, Rljm René; Schreurs, Pjg Piet; Geers, Mgd Marc

doi:10.1016/j.mechmat.2006.11.001

Cited by 22 publications

(14 citation statements)

References 43 publications

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“…Thermal fatigue is still a major issue in many industrial activities, as proven by very recent publications on this subject in aircraft [1,2], automotive [3,4], metal forming [5][6][7], braking [8][9][10], electronic [11,12] and nuclear [13][14][15][16] industries.…”

Section: Introductionmentioning

confidence: 99%

A probabilistic model to predict the formation and propagation of crack networks in thermal fatigue

Malesys

Vincent

Hild

2009

International Journal of Fatigue

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A probabilistic model is presented to predict the formation and propagation of crack networks in thermal fatigue. It is based on a random distribution of sites where cracks initiate and on the shielding phenomenon corresponding to the relaxed stress field created around cracks. Currently, the model considers only heterogeneous uniaxial stress loading even if thermal fatigue is multiaxial. However, the first simulations on a uniaxial mechanical loading representative of the stress gradient that appears in thermal fatigue shocks are in qualitative agreement with experimental results. The larger the stress amplitude, the denser the crack network and the smaller the crack sizes.

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Section: Introductionmentioning

confidence: 99%

A probabilistic model to predict the formation and propagation of crack networks in thermal fatigue

Malesys

Vincent

Hild

2009

International Journal of Fatigue

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“…Each parameter is usually interpolated between the limit values known for each phase. This is the formulation adopted in the finite element simulations of Cahn-Hilliard like equations coupled with viscoplasticity in [38,39] for tin-lead solders. The same methodology is used in [19,20] ε at this material point must then be averaged or interpolated from the values attributed to each phase.…”

Section: Phase-field Models For Elastoviscoplastic Materialsmentioning

confidence: 99%

“…The effect of microelasticity on the morphological aspects and kinetics of phase transformation is classically studied but the occurrence of plasticity is recent [19,20,38]. Beyond plasticity, damage and crack propagation are the subject of both generalized continuum and phase-field approaches [6,17,31,32,39]. Phase-field simulations usually rely on finite differences or fast Fourier methods.…”

Section: Introductionmentioning

confidence: 99%

Micromorphic vs. Phase-Field Approaches for Gradient Viscoplasticity and Phase Transformations

Forest

Ammar

Appolaire

2011

Advances in Extended and Multifield Theories for Continua

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Abstract. Strain gradient models and generalized continua are increasingly used to introduce characteristic lengths in the mechanical behavior of materials with microstructure. On the other hand, phase-field models have proved to be efficient tools to simulate microstructure evolution due to thermodynamical processes in the presence of mechanical deformation. It is shown that both methods have strong connections from the point of view of thermomechanical field theory. A general formulation of thermomechanics with additional degrees of freedom is presented that encompasses both applications as special cases. It is based on the introduction of additional power of internal forces introducing generalized stresses. The current knowledge in the formulation of physically non-linear constitutive equations is used to develop strongly coupled elastoviscoplastic material models involving phase transformation and moving boundaries.

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“…During the thermal cycling of polycrystalline Sn, this CTE anisotropy leads to plastic deformation concentrated near grain boundaries where there is CTE mismatch and the expansion is constrained [12,13]. In the more complex situation of BGA joints, CTE mismatch-induced cracking near the chip-side solder-substrate interface is a widespread failure mode and occurs by a combination of creep, recovery and recrystallization [3,[14][15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Anisotropic thermal expansion of Ni 3 Sn 4 , Ag 3 Sn, Cu 3 Sn, Cu 6 Sn 5 and βSn

et al. 2017

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The directional coefficient of thermal expansion (CTE) of intermetallics in electronic interconnections is a key thermophysical property that is required for microstructurelevel modelling of solder joint reliability. Here, CTE ellipsoids are measured for key solder intermetallics using synchrotron x-ray diffraction (XRD). The role of the crystal structure used for refinement on the CTE shape and temperature dependence is investigated. The results are used to discuss the Sn-IMC orientation relationships (ORs) that minimise the in-plane CTE mismatch on IMC growth facets, which are measured with electron backscatter diffraction (EBSD) in solder joints on Cu and Ni substrates. The CTE mismatch in fully-intermetallic joints is discussed, and the relationship between the directional CTE of monoclinic and hexagonal polymorphs of Cu6Sn5 is explored.

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Elasto-viscoplastic nonlocal damage modelling of thermal fatigue in anisotropic lead-free solder

Cited by 22 publications

References 43 publications

A probabilistic model to predict the formation and propagation of crack networks in thermal fatigue

A probabilistic model to predict the formation and propagation of crack networks in thermal fatigue

Micromorphic vs. Phase-Field Approaches for Gradient Viscoplasticity and Phase Transformations

Anisotropic thermal expansion of Ni 3 Sn 4 , Ag 3 Sn, Cu 3 Sn, Cu 6 Sn 5 and βSn

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