Elastic properties of ultrathin diamond/AlN membranes

Zuerbig, Verena; Hees, Jakob; Pletschen, W.; Sah, R. E.; Wolfer, Marco; Kirste, Lutz; Heidrich, N.; Nebel, Christoph E.; Ambacher, O.; Lebedev, V.

doi:10.1016/j.tsf.2014.03.015

Cited by 10 publications

(4 citation statements)

References 34 publications

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“…Here, the Young's modulus of NCD:B (E NCD ) and the residual strain (ε) were used as the fit parameters. The best fit was obtained with NCD:B Young's modulus E NCD = 1040 ± 20 GPa and nearly zero strain conditions |ε| < 50 MPa, indicating that the AWB transfer followed by micro-fabrication process did not affect either the layer integrity or its mechanical properties and that the AWB NCD:B material parameters match those of NCD:B directly grown on Si substrates [27] The mechanical quality factors of the cantilevers derived from the in vacuo LDV measurements range from 5000 at 0.3 MHz to 600 at 10 MHz for the ground C0 mode. These dependencies are further discussed together with the dominant loss mechanisms in the AWB-transferred resonators in the next section.…”

Section: Mechanical Vibrations Of the Beam Resonatorsmentioning

confidence: 88%

Nanodiamond resonators fabricated on 8″ Si substrates using adhesive wafer bonding

Lebedev

Lisec

Yoshikawa

et al. 2017

J. Micromech. Microeng.

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In this work, the adhesive wafer bonding of diamond thin films onto 8″ silicon substrates is reported. In order to characterize bonded nano-crystalline diamond layers, vibrometry and interferometry studies of micro-fabricated flexural beam and disk resonators were carried out. In particular, surface topology along with resonant frequencies, eigenmodes and mechanical quality factors were recorded and analyzed in order to obtain physical parameters of the transferred films. The vibration properties of the bonded resonators were compared to those fabricated directly on 3″ silicon substrates.

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Section: Mechanical Vibrations Of the Beam Resonatorsmentioning

confidence: 88%

Nanodiamond resonators fabricated on 8″ Si substrates using adhesive wafer bonding

Lebedev

Lisec

Yoshikawa

et al. 2017

J. Micromech. Microeng.

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“…Similarly, the properties of bilayers obtained by growing nanocrystalline diamond on aluminum nitride thin films, of about 200 + 200 nm thickness, were measured producing microresonators, either cantilevers or bridges, of length up to 50 μm, piezoelectrically actuated and measured by laser Doppler vibrometry [30]. Similar nanocrystalline diamond/aluminum nitride membranes, of thicknesses of the order of hundreds of nanometers, were still characterized by the bulge test on circular clamped membranes, of radii up to 1 mm [31].…”

Section: Measurement Techniques Based On Testing Structuresmentioning

confidence: 99%

Ultrasonic and Spectroscopic Techniques for the Measurement of the Elastic Properties of Nanoscale Materials

Beghi¹

2021

Nanomechanics - Theory and Application

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Materials at the nanoscale often have properties which differ from those they have in the bulk form. These properties significantly depend on the production process, and their measurement is not trivial. The elastic properties characterize the ability of materials to deform in a reversible way; they are of interest by themselves, and as indicators of the type of nanostructure. As for larger scale samples, the measurement of the elastic properties is more straightforward, and generally more precise, when it is performed by a deformation process which involves exclusively reversible strains. Vibrational and ultrasonic processes fulfill this requirement. Several measurement techniques have been developed, based on these processes. Some of them are suitable for an extension towards nanometric scales. Until truly supramolecular scales are reached, the elastic continuum paradigm remains appropriate for the description and the analysis of ultrasonic regimes. Some techniques are based on the oscillations of purpose-built testing structures, mechanically actuated. Other techniques are based on optical excitation and/or detection of ultrasonic waves, and operate either in the time domain or in the frequency domain. A comparative overview is given of these various techniques.

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“…It is worth noting that the refractive indices of SiO 2 , Si 3 N 4 , and AlN are less than that of diamond in the wavelength range of 7.7-13.7 μm; furthermore, they have good adhesion with diamond, which enables their use as a transition layer for CVD diamonds. [17] However, the transmittance or the boundary evanescent field, and geometry of waveguide, in the band of 7.7-13.7 μm, of these materials has, hitherto, not been measured or simulated.…”

Section: Introductionmentioning

confidence: 99%

Design and Performance of Diamond‐Based Mid‐Infrared Sensor

Chen

et al. 2020

Physica Status Solidi (a)

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Herein, finite‐element analysis is used to optimize the performance of mid‐infrared (MIR) (7.7–13.7 μm) waveguides by selecting optimal waveguide and substrate materials, waveguide size, and boundary field. The results show that a diamond waveguide has a substantially higher sensitivity than Si‐ or Ge‐based waveguides owing to its higher boundary evanescent field at the same depth. Furthermore, it is found that AlN substrates have better optical stabilities than SiO2 and Si3N4 substrates, because AlN substrates do not have apparent absorption characteristics in the MIR range (7.7–13.7 μm). Geometry of diamond waveguide on AlN substrate is optimized, and a section length of 45 μm is chosen for optimal signal transmission quality. The calculations of the infrared attenuated total reflection (ATR) of the diamond waveguide applied to water, alcohol, and diisopropyl methyl phosphate are highly consistent with the actual infrared absorption spectrum. This proves the feasibility of applying AlN/diamond waveguides in MIR ATR detection, which is of great significance for the preparation of high‐sensitivity MIR detectors.

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Elastic properties of ultrathin diamond/AlN membranes

Cited by 10 publications

References 34 publications

Nanodiamond resonators fabricated on 8″ Si substrates using adhesive wafer bonding

Nanodiamond resonators fabricated on 8″ Si substrates using adhesive wafer bonding

Ultrasonic and Spectroscopic Techniques for the Measurement of the Elastic Properties of Nanoscale Materials

Design and Performance of Diamond‐Based Mid‐Infrared Sensor

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