Elastic Properties of Sn-Based Pb-Free Solder Alloys Determined by Ultrasonic Pulse Echo Method

Tanaka, Hiroyuki; Qun, Lang Feng; Munekata, Osamu; Toshihiko, Taguchi; Narita, Toshio

doi:10.2320/matertrans.46.1271

Cited by 25 publications

(6 citation statements)

References 4 publications

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“…The elastic modulus of IS48 is in agreement with the value reported by Kim [59]. All alloys exhibit a low elastic modulus compared to that of commercial SAC305 alloy (54.0 GPa) [36] and Sn-58Bi alloy (41.3 GPa) [60]. This is an advantage of IS48, ISC482, and ISC488 alloys to be able to apply in flexible electronic devices.…”

Section: Elastic Modulus Of Alloyssupporting

confidence: 87%

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Han

Shen

Huo

et al. 2021

Metals

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The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint.

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Section: Elastic Modulus Of Alloyssupporting

confidence: 87%

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Han

Shen

Huo

et al. 2021

Metals

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“… ,, Dip-Dip exhibited a Young’s modulus of 70.3 ± 20.6 GPa (Figure b), point stiffness of 449.1 ± 88.3 N m –1 (Figure c) and shear modulus of 9.3 ± 0.5 GPa (Figure d), 4-fold, 2-fold, and 8-fold higher than FF, respectively (Figure e). , The Dip-Dip Young’s modulus is comparable to that of metals such as aluminum and gold, and is much higher than softer metals such as magnesium, tin and several rigid organic materials (Figure f, Table S2). ,− Cyclo-Dip-Dip and Boc-Dip-Dip also showed a similar improvement in the elastic properties with Young’s moduli of 41.5 ± 26.0 GPa and 43.9 ± 9.4 GPa, point stiffness of 268.4 ± 129.7 N m –1 and 227.9 ± 44.2 N m –1 and shear modulus of 4.1 ± 0.4 GPa and 3.9 ± 0.1 GPa, respectively (Figure S14). While the magnitude of elastic constants of these crystals is somewhat lower than Dip-Dip, it is still much higher than cyclo-FF (13.3 ± 1.1) and Boc-FF (7.9 ± 5.5) crystals (Figure S14).…”

Section: Resultsmentioning

confidence: 77%

Diphenylalanine-Derivative Peptide Assemblies with Increased Aromaticity Exhibit Metal-like Rigidity and High Piezoelectricity

et al. 2020

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Diphenylalanine (FF) represents the simplest peptide building block that self-assembles into ordered nanostructures with interesting physical properties. Among self-assembled peptide structures, FF nanotubes display notable stiffness and piezoelectric parameters (Young’s modulus = 19–27 GPa, strain coefficient d 33 = 18 pC/N). Yet, inorganic alternatives remain the major materials of choice for many applications due to higher stiffness and piezoelectricity. Here, aiming to broaden the applications of the FF motif in materials chemistry, we designed three phenyl-rich dipeptides based on the β,β-diphenyl-Ala-OH (Dip) unit: Dip-Dip, cyclo-Dip-Dip, and tert-butyloxycarbonyl (Boc)-Dip-Dip. The doubled number of aromatic groups per unit, compared to FF, produced a dense aromatic zipper network with a dramatically improved Young’s modulus of ∼70 GPa, which is comparable to aluminum. The piezoelectric strain coefficient d 33 of ∼73 pC/N of such assembly exceeds that of poled polyvinylidene-fluoride (PVDF) polymers and compares well to that of lead zirconium titanate (PZT) thin films and ribbons. The rationally designed π–π assemblies show a voltage coefficient of 2–3 Vm/N, an order of magnitude higher than PVDF, improved thermal stability up to 360 °C (∼60 °C higher than FF), and useful photoluminescence with wide-range excitation-dependent emission in the visible region. Our data demonstrate that aromatic groups improve the rigidity and piezoelectricity of organic self-assembled materials for numerous applications.

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“…The solder filling has been attempted in order to study the effect of the impregnation material stiffness. The Sn96Ag4 E-modulus is about 50 GPa [25] compared to the CDT-101K E-modulus of 3.8 GPa [26]. The Sn96Ag4 filled ten-stack exhibits a comparatively higher Nb3Sn loading stress and Nb3Sn stress inhomogeneity.…”

Section: Discussionmentioning

confidence: 89%

Effect of Applied Compressive Stress and Impregnation Material on Internal Strain and Stress State in Nb₃Sn Rutherford Cable Stacks

Wolf

Scheuerlein

Lorentzon

et al. 2019

IEEE Trans. Appl. Supercond.

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The Nb3Sn superconductor in accelerator magnets must resist high mechanical stresses. In order to understand better the effect of the coil impregnation system on the stresses exerted on the strain-sensitive Nb3Sn superconductor, we have measured the elastic strain evolution in the conductor constituents under externally applied loads. For this purpose a dedicated load frame that enables rotation of the sample load axis with respect to the neutron scattering geometry was installed in the Stress-Spec beamline at the neutron source Heinz Maier-Leibnitz FRM II. The Nb3Sn and Cu loading strain was measured in situ by neutron diffraction under monotonic and cyclic compressive loading. Socalled ten-stack samples composed of Nb3Sn Rutherford type cable with different impregnation, and coil blocks extracted from a 11 T dipole short model coil were investigated.

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Elastic Properties of Sn-Based Pb-Free Solder Alloys Determined by Ultrasonic Pulse Echo Method

Cited by 25 publications

References 4 publications

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Diphenylalanine-Derivative Peptide Assemblies with Increased Aromaticity Exhibit Metal-like Rigidity and High Piezoelectricity

Effect of Applied Compressive Stress and Impregnation Material on Internal Strain and Stress State in Nb₃Sn Rutherford Cable Stacks

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Elastic Properties of Sn-Based Pb-Free Solder Alloys Determined by Ultrasonic Pulse Echo Method

Cited by 25 publications

References 4 publications

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Diphenylalanine-Derivative Peptide Assemblies with Increased Aromaticity Exhibit Metal-like Rigidity and High Piezoelectricity

Effect of Applied Compressive Stress and Impregnation Material on Internal Strain and Stress State in Nb3Sn Rutherford Cable Stacks

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Effect of Applied Compressive Stress and Impregnation Material on Internal Strain and Stress State in Nb₃Sn Rutherford Cable Stacks