EIS and statistical analysis of copper electrodeposition accounting for multi-component transport and reactions

Garrido, Mariano; Pritzker, Mark

doi:10.1016/j.jelechem.2006.05.026

Cited by 25 publications

(6 citation statements)

References 40 publications

(72 reference statements)

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“…In addition, copper(II) sulfate and boric acid, which is commonly added to suppress hydrogen evolution at high voltages, are slightly acidic, thus it is possible that charge regulation and pH changes provide additional conductivity [32]. We have also used the simplest reaction model for copper electro-deposition/dissolution, but more sophisticated reaction models do not assume any rate-determining step and take into account additional phenomena such as the adsorption of copper(I) ions on the electrode surface [48][49][50]. Using these models may help with achieving better predictions for the current-voltage relation, especially at low voltages when the system is reaction-limited.…”

Section: Discussionmentioning

confidence: 99%

“…For electrochemical reaction kinetics, we use Butler-Volmer reaction kinetics [1,2,43,44] and focus on copper electrodeposition and electrodissolution as a classic example whose reaction mechanism and parameters are well studied [1,[45][46][47]. There are more sophisticated reaction models for copper electrodeposition and electrodissolution that, for example, take into account the adsorption of copper(I) ions on the electrode surface and do not assume any rate-determining step [48][49][50]. In the interest of being able to derive analytical or semi-analytical expressions for quantities of interest, we do not account for these additional complications in the reaction model.…”

Section: Introductionmentioning

confidence: 99%

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Theory of voltammetry in charged porous media

Khoo

Bazant

2018

Journal of Electroanalytical Chemistry

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We couple the Leaky Membrane Model, which describes the diffusion and electromigration of ions in a homogenized porous medium of fixed background charge, with Butler-Volmer reaction kinetics for flat electrodes separated by such a medium in a simple mathematical theory of voltammetry.The model is illustrated for the prototypical case of copper electro-deposition/dissolution in aqueous charged porous media. We first consider the steady state with three different experimentally

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Theory of voltammetry in charged porous media

Khoo

Bazant

2018

Journal of Electroanalytical Chemistry

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“…It measures the electrode response when a small-amplitude periodic sinusoidal wave is superimposed on a dc input signal over a range of frequencies. EIS is a useful technique for studying metal electrodeposition [15][16][17]. Recently, a few studies on electrochemical impedance spectroscopy (EIS) measurements of U in molten salt using solid cathode have been reported.…”

Section: Introductionmentioning

confidence: 99%

A study on the electrochemical deposition behavior of uranium ion in a LiCl–KCl molten salt on solid and liquid electrode

Kim

Yoon

Paek

et al. 2012

Journal of Electroanalytical Chemistry

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“…The bulk region was considered to be fully established at a distance of 3␦ from the electrode surface, where ␦ is the boundary layer thickness, defined by the following equation (Huerta Garrido and Pritzker, 2006):…”

Section: Kinetic and Hydrodynamic Equationsmentioning

confidence: 99%

“…Figure 2 shows the simulated primary, secondary and tertiary current distributions along the working electrode. Simulated current distribution was fitted by an exponential decay function for the electrode with radius r. The curves show that the dimensionless current density increases monotonously with electrode radius: The primary current density along the RDE surface is dependent exclusively on the geometry of the bath and is determined by the gradient of local potential, according to Ohm's Law (Huerta Garrido and Pritzker, 2006;Low et al, 2007). The simulated primary current distribution follows a non-uniform profile along the cathode.…”

Section: Kinetic and Hydrodynamic Equationsmentioning

confidence: 99%

Multiphysics coupling simulation of RDE for PCB manufacturing

Wang

et al. 2015

Circuit World

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Purpose -The purpose of this paper is to optimize experimental parameters and gain further insights into the plating process in the fabrication of high-density interconnections of printed circuit boards (PCBs) by the rotating disc electrode (RDE) model. Via metallization by copper electrodeposition for interconnection of PCBs has become increasingly important. In this metallization technique, copper is directly filled into the vias using special additives. To investigate electrochemical reaction mechanisms of electrodeposition in aqueous solutions, using experiments on an RDE is common practice. Design/methodology/approach -An electrochemical model is presented to describe the kinetics of copper electrodeposition on an RDE, which builds a bridge between the theoretical and experimental study for non-uniform copper electrodeposition in PCB manufacturing. Comsol Multiphysics, a multiphysics simulation platform, is invited to modeling flow field and potential distribution based on a two-dimensional (2D) axisymmetric physical modeling. The flow pattern in the electrolyte is determined by the 2D Navier-Stokes equations. Primary, secondary and tertiary current distributions are performed by the finite element method of multiphysics coupling. Findings -The ion concentration gradient near the cathode and the thickness of the diffusion layer under different rotating velocities are achieved by the finite element method of multiphysics coupling. The calculated concentration and boundary layer thicknesses agree well with those from the theoretical Levich equation. The effect of fluid flow on the current distribution over the electrode surface is also investigated in this model. The results reveal the impact of flow parameters on the current density distribution and thickness of plating layer, which are most concerned in the production of PCBs. Originality/value -By RDE electrochemical model, we build a bridge between the theoretical and experimental study for control of uniformity of plating layer by concentration boundary layer in PCB manufacturing. By means of a multiphysics coupling platform, we can accurately analyze and forecast the characteristic of the entire electrochemical system. These results reveal theoretical connections of current density distribution and plating thickness, with controlled parameters in the plating process to further help us comprehensively understand the mechanism of copper electrodeposition.

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EIS and statistical analysis of copper electrodeposition accounting for multi-component transport and reactions

Cited by 25 publications

References 40 publications

Theory of voltammetry in charged porous media

Theory of voltammetry in charged porous media

A study on the electrochemical deposition behavior of uranium ion in a LiCl–KCl molten salt on solid and liquid electrode

Multiphysics coupling simulation of RDE for PCB manufacturing

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