Einfluss mikrogeformter Kanten an Metalleinlegern auf die Temperaturwechsel-beständigkeit mediendichter Kunststoff-Metall-Hybriden

Heinle, Martina

doi:10.3139/o999.03032018

Cited by 2 publications

(1 citation statement)

References 1 publication

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“…In the injection molding process, the platelet‐shaped fillers are predominantly oriented in the X‐Y plane, which is a result of the occurring shear and expansion flows in the injection molding process. [ 26 ] In addition, BN shows a thermal conductivity of 400 W/(m*K) along the planes, while it is only 2 W/(m*K) through plane. For POM values up to 3.70 W/(m*K) in X‐direction and 0.76 W/(m*K) in Z‐direction were measured.…”

Section: Resultsmentioning

confidence: 99%

The effect of dielectric and thermal properties of plastic mold materials on the high frequency welding of three‐dimensional foam components

Schneider

Gothe

Drexler

et al. 2022

Polymer Engineering & Sci

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High-frequency heating processes are widely used in industry, for example, for food processing, wood drying, or plastic welding. A recent development in this field uses radio-frequency heating to fuse particle foam beads to complex components. The aim of using the modified process is to reduce the energy consumption of particle foam fusion. Within this process, the molds used must be electrically insulating to ensure the building of an electrical field. For this purpose, mold made of two different plastics were analyzed.Additional to the dielectric, mechanical, and thermal expansion, the thermal conductivity of the mold materials are of great interest. Although welding is finished quickly, cooling to the demolding temperature is comparably long.To achieve shorter cooling and therefore shorter process times, the mold materials were modified by two different thermal conductive but electrically insulating fillers. By the use of the thermally optimized mold materials, a reduction in cooling time of up to 40% was possible. At the same time, the heating step was hardly affected. Mechanical properties were enhanced while thermal expansion was reduced.

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Section: Resultsmentioning

confidence: 99%

The effect of dielectric and thermal properties of plastic mold materials on the high frequency welding of three‐dimensional foam components

Schneider

Gothe

Drexler

et al. 2022

Polymer Engineering & Sci

View full text Add to dashboard Cite

show abstract

Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding

Ott

Drummer

2022

Journal of Polymer Engineering

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The direct encapsulation of electronic components is an effective way of protecting components against external influences. In addition to achieving a sufficient protective effect, there are two other big challenges for satisfying the increasing demand for encapsulated circuit boards. The encapsulation process should be both suitable for mass production and offer a low component load. Injection molding is a method with good suitability for large series production but also with typically high component stress. In this article, two aims were pursued: first, the development of a calculation model that allows an estimation of the occurring forces based on process variables and material parameters. Second, the evaluation of a new approach for stress reduction by means of thermoplastic foam injection molding. For this purpose, simulation-based process data was generated with the Moldflow simulation tool. Based on this, component stresses were calculated with the calculation model. The suitability of the new approach was clearly demonstrated and a significant reduction in shear forces during overmolding was achieved. It was possible to demonstrate a process development that makes it possible to meet the two main requirements of direct encapsulation in addition to a high protective effect.

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Einfluss mikrogeformter Kanten an Metalleinlegern auf die Temperaturwechsel-beständigkeit mediendichter Kunststoff-Metall-Hybriden

Abstract: Influence of micro formed edges of metal inserts on temperature cycling durability of tight polymer metal hybrids

Cited by 2 publications

References 1 publication

The effect of dielectric and thermal properties of plastic mold materials on the high frequency welding of three‐dimensional foam components

The effect of dielectric and thermal properties of plastic mold materials on the high frequency welding of three‐dimensional foam components

Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding

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