1989
DOI: 10.1038/340621a0
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Efficient photovoltaic devices for InP semiconductor/liqud junctions

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Cited by 21 publications
(18 citation statements)
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“…This is consistent with the n-InP/KCl­(aq)–Fe­(CN) 6 3‑/4‑ junction . Compared to the data on n-InP/CH 3 OH–Me 2 Fc +/0 contacts studied previously, the low current density indicates that the hole transfer was very slow at the n-InP/Na 2 S–Na 2 SO 3 interface. This may be due to a small potential barrier formed at the n -InP/polysulfide electrolyte interface.…”
Section: Resultssupporting
confidence: 88%
See 1 more Smart Citation
“…This is consistent with the n-InP/KCl­(aq)–Fe­(CN) 6 3‑/4‑ junction . Compared to the data on n-InP/CH 3 OH–Me 2 Fc +/0 contacts studied previously, the low current density indicates that the hole transfer was very slow at the n-InP/Na 2 S–Na 2 SO 3 interface. This may be due to a small potential barrier formed at the n -InP/polysulfide electrolyte interface.…”
Section: Resultssupporting
confidence: 88%
“…It is widely used as photocathodes for PEC hydrogen production attributing to its favorable conduction band position for water reduction and its low surface-recombination velocity. Recently, p-InP photocathode has achieved a benchmark solar-to-hydrogen efficiency of approximately 15.8% . The PEC properties of n-type InP has also been intensively studied but mainly using sacrificial-reagent-containing electrolytes due to its poor stability for water oxidation. Recently, InP photoanodes with effective protective coatings have shown excellent PEC performances for water oxidation in 1.0 M KOH solution. , However, most of these studies were conducted with planar InP that has relatively small surface areas. Our group and other groups have demonstrated that 2D InP NP photoanodes exhibited superior PEC performances compared to their planar counterparts. , However, the photocurrent density is still low mainly attributed to high surface recombination at surface states .…”
Section: Introductionmentioning
confidence: 99%
“…Figure displays the J − E data for n-InP anodes in contact with KCl(aq)−0.100 M Fe(CN) 6 4- −0.100 M Fe(CN) 6 3- . When compared to data on n-InP/CH 3 OH−Me 2 Fc +/0 contacts studied previously and reevaluated in the course of this work (Figure a), the current densities in Figure b were extremely small at low forward bias. Even at an electrode potential of −1.0 V vs E (A/A - ), the current density at the n-InP/KCl(aq)−Fe(CN) 6 3-/4- junction was only on the order of 10 -3 A cm -2 .…”
Section: Resultsmentioning
confidence: 55%
“…Figure 7 displays the J-E data for n-InP anodes in contact with KCl(aq)-0.100 M Fe(CN) 6 4--0.100 M Fe(CN) 6 3-. When compared to data on n-InP/CH 3 OH-Me 2 -Fc +/0 contacts studied previously 69 and reevaluated in the course of this work (Figure 7a), the current densities in Figure 7b were Although the short-circuit current density was zero at n-InP/ CH 3 OH/Me 2 Fc +/0 contacts, a nonzero short-circuit current density of 0.5 µA cm -2 was observed for n-InP/KCl(aq)-Fe-(CN) 6 3-/4-junctions. The presence of a finite current density at short circuit indicated the presence of a chemical passivation or corrosion reaction at the n-InP/KCl(aq)-Fe(CN) 6 3-/4-contact.…”
Section: Barrier Height Measurements and Upper Bounds On K Et For mentioning
confidence: 99%
“…17 In fact, the early studies that characterized electron transfer across the Si-solution interface required dry, non-aqueous solvents and many were performed in inert atmospheres. [18][19][20] A number of approaches have been developed to protect the interface including employing ultrathin oxides, [21][22][23][24] 1-and 2D materials, [25][26][27] wet-chemical functionalization, 28 and continuous thin metal films. [29][30][31] A second major barrier for LAES is that close electronic coupling between the Si surface and the redox couple is required for efficient electron transfer.…”
Section: Methodsmentioning
confidence: 99%