2011
DOI: 10.1109/led.2011.2163490
|View full text |Cite
|
Sign up to set email alerts
|

Efficiency Enhancement of InGaN LEDs With an n-Type AlGaN/GaN/InGaN Current Spreading Layer

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
16
0

Year Published

2013
2013
2020
2020

Publication Types

Select...
8
1

Relationship

0
9

Authors

Journals

citations
Cited by 17 publications
(16 citation statements)
references
References 14 publications
0
16
0
Order By: Relevance
“…The NPNPN-GaN junctions can also reduce the current crowding and thus promote the lateral current spreading. As the energy barriers for the electrons in the conduction band of the n-GaN region have been generated, the NPNPN-GaN junctions increase the layer resistivity vertically, which is beneficial for better current spreading [15][16][17]. Figures 6(a) and 6(b) depict the simplified equivalent circuits of the reference device and the NPNPN-GaN device.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The NPNPN-GaN junctions can also reduce the current crowding and thus promote the lateral current spreading. As the energy barriers for the electrons in the conduction band of the n-GaN region have been generated, the NPNPN-GaN junctions increase the layer resistivity vertically, which is beneficial for better current spreading [15][16][17]. Figures 6(a) and 6(b) depict the simplified equivalent circuits of the reference device and the NPNPN-GaN device.…”
Section: Resultsmentioning
confidence: 99%
“…It has been reported that improving the p-type specific contact resistance helps to achieve a better current spreading [13,14]. Meanwhile, it has been also shown that the current crowding decreases when the device is more resistive vertically [12], and an n-type InGaN current spreading layer has therefore been proposed to realize a better current spreading [15,16]. Due to the relatively low growth temperature the crystal quality of the n-type InGaN current spreading layer would be inferior to that of hightemperature grown GaN, which may give rise to non-radiative recombination defects.…”
Section: Introductionmentioning
confidence: 99%
“…In this paper, we replace the conventional n-AlGaN layer with a 60-period stacked Si modulation-doped 20-nm n-AlGaN/15-nm u-GaN structure to obtain a well-distributed current. A multi-layer stacked n-AlGaN/u-GaN structure not only reduces the dislocation density, but also improves the electron concentration, weakens electron scattering, and increases electron mobility [25,26]. Here, it is worth noting that devices with a multi-layer stacking structure exhibit a 22% and 26.5% enhancement in the output power and external quantum efficiency (EQE), respectively, under a 20-mA injection current.…”
Section: Introductionmentioning
confidence: 99%
“…LEDs are the most important lighting devices in the future due to their advantages in terms of environmental protection, long lifetime, and vivid color. However, some existing mechanisms of the LEDs can still lead to the efficiency droop effect, such as electron overflow loss [1][2][3], lacking in hole injection [4,5], Auger recombination [6][7][8], carrier delocalization [9,10], junction heating [11], and current crowding [12].…”
Section: Introductionmentioning
confidence: 99%