2020
DOI: 10.1007/s11664-020-08318-0
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Effects of γ-Ray Irradiation on AlGaN/GaN Heterostructures and High Electron Mobility Transistor Devices

Abstract: This study examined the effects of three cumulative c-ray irradiation doses on AlGaN/GaN epilayer material and on high electron mobility transistor (HEMT) devices. After a cumulative c-ray dose of 16 kGy, the Hall mobility increased from 1800 cm 2 /V s to 2100 cm 2 /V s, as determined through Hall measurement. Atomic force microscopy indicated an improvement in surface roughness but no change in the surface potential ; s ð Þ. The HEMT device exhibited improvement in the drain current, with a subtle decreasing … Show more

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Cited by 9 publications
(10 citation statements)
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References 29 publications
(43 reference statements)
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“…It is well known that γ-rays affect trapping sites at the semiconductor interface and modify the concentration of the traps. 14,22) Nevertheless, as shown in Table I, the I ON /I OFF ratio and the subthreshold swing were improved after γ-ray irradiation. This is due to the decrease of total carriers as both I ON and I OFF are decreased.…”
Section: -2mentioning
confidence: 95%
“…It is well known that γ-rays affect trapping sites at the semiconductor interface and modify the concentration of the traps. 14,22) Nevertheless, as shown in Table I, the I ON /I OFF ratio and the subthreshold swing were improved after γ-ray irradiation. This is due to the decrease of total carriers as both I ON and I OFF are decreased.…”
Section: -2mentioning
confidence: 95%
“…Therefore, it is important to study the influence of high-energy irradiation on GaN-based devices [5][6][7][8][9]. The results show that GaN-based devices have high sensitivity to relatively low-dose gamma ray, electron, proton, and neutron irradiation [10][11][12][13][14][15]. The performance of GaN-based * Author to whom any correspondence should be addressed.…”
Section: Introductionmentioning
confidence: 99%
“…[20][21][22] The TLM method is the most widely used method, which requires specic test areas with varying pitches on the wafer, and the parameters are derived from linear tting results. [23][24][25][26] However, it is susceptible to process non-uniformity and has specic design and ow requirements. Thus, these classical methods have higher process requirements and more complex calculations, resulting in lower accuracy in extracting mobility, compared to the direct extraction of contact resistance and mobility from the completed device.…”
Section: Introductionmentioning
confidence: 99%