Effects of varying amplitudes on the fatigue life of lead free solder joints

Obaidat, Mazin; Hamasha, Sa’d; Jaradat, Younis; Qasaimeh, Awni; Arfaei, Babak; Anselm, Martin; Børgesen, Peter

doi:10.1109/ectc.2013.6575741

Cited by 25 publications

(4 citation statements)

References 5 publications

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“…Fig. 5 shows the typical behavior of inelastic work per cycle in isothermal cycling of an SAC305 solder joint with fixed load amplitude [4], [24]. The initial drop in work per cycle represents solder joint flattening, due to the contact between the cylindrical tip and the solder sphere, and possibly strain hardening.…”

Section: Resultsmentioning

confidence: 99%

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Hamasha

Qasaimeh

Jaradat

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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The fatigue behavior of solder joints in realistic service applications is still not well understood. Service life prediction based on conducting accelerated tests and extrapolating test results therefore involves a high potential for error. Understanding both the evolution of solder joint properties and the damage accumulation has proved to be critical to reliability modeling. Damage accumulation in isothermal cycling is shown to scale with the accumulated inelastic work even in complex cycling scenarios, so that the life of a solder joint ends upon accumulation of a given amount of work. Individual ball grid array solder joints were cycled in shear fatigue experiments with different load amplitudes and strain rates. The effects of load amplitudes and strain rates on the work accumulation and fatigue life were systematically addressed. The correlation between different loading scenarios and the accumulated work to failure was also discussed. The results showed that the accumulated work until the development of a major crack is constant regardless of the load amplitude. After that the accumulated work to failure is lower for larger load amplitudes. For some reason, a larger fraction of the work appears to be dissipating as heat at lower load amplitude, but only during crack growth. On the other hand, the strain rate affects the fraction of the work going to heat even before the development of a major crack.

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Section: Resultsmentioning

confidence: 99%

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Hamasha

Qasaimeh

Jaradat

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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show abstract

“…A higher amplitude value was reported to result in a steeper amplification slope for the SAC305 alloy [ 22 ]. In addition, with high amplitude cycle counts in each set, the slope of amplification in SAC305 increased, but it eventually leveled off [ 29 ]. Furthermore, the work amplification value at lower amplitudes is influenced by the sequence of larger amplitudes preceding the lower stress amplitude [ 7 ].…”

Section: Resultsmentioning

confidence: 99%

Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions

et al. 2023

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Solder joints are subjected to varied stress cycle circumstances in the electronic packaging service life but are also influenced by aging. There has been limited investigation into the influence of aging and varying cycles on SnAgCu-Bi (SAC-Bi) solder joint fatigue. Cyclic fatigue tests were performed on solder joints of several alloys, including SnAgCu (SAC305), SnAgCu-Bi (SAC-Q), and SnCu-Bi (SAC-R). Individual solder joints were cycled under varying stress levels, alternating between mild and harsh stress levels. At least seven samples were prepared for each alloy by alternating between 25 mild stress (MS) cycles and three harsh stress (HS) cycles until the solder joint broke off. The impact of aging on Bi-doped solder joints fatigue under varied amplitude stress was examined and predicted for 10 and 1000 h under 125 °C. Because of the “Step-up” phenomenon of inelastic work, a new fatigue model was developed based on the common damage accumulation (CDA) model. The experimental results revealed that aging reduced the fatigue life of the tested solder alloys, particularly that of SAC305. According to the CDA model, all solder alloys failed earlier than expected after aging. The proposed model uses the amplification factor to assess inelastic work amplification after switching between the MS and HS cycles under varying stress amplitude conditions. The amplification factor for the SAC-Bi solder alloys increased linearly with fracture initiation and substantially followed crack propagation until the final failure. Compared with existing damage accumulation models, the proposed fatigue model provides a more accurate estimation of damage accumulation. For each case, the cut-off positions were examined. The SAC-Q amplification factor increased linearly to 83% of its overall life, which was much higher than that of SAC305 and SAC-R. This study identified three distinct failure modes: ductile, brittle, and near intermetallic compound (IMC) failure. It was also observed that SAC-Q with an organic solderability preservatives (OSP) surface finish was more susceptible to brittle failure owing to the excessive brittleness of the alloy material.

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“…If the temperature distribution inside the chip package is not uniform, the signal transmission characteristics of the chip will be influenced, thereby affecting the life and reliability of the electronic device. Additionally, because of the differences in the thermal expansion coefficient between chip packaging materials [31][32][33][34][35][36][37][38][39][40][41][42][43][44], different materials have different degrees of thermal expansion and contraction under the influence of temperature. This results in additional stress and strain inside the electronic components, especially inside solder joints.…”

Section: Fatigue Failure Factors Of Bga Solder Jointsmentioning

confidence: 99%

Survey on Fatigue Life Prediction of BGA Solder Joints

et al. 2022

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With the development of science and technology, consumers’ requirements for various electronic devices present a trend of more diverse functions and thinner bodies. This makes integrated circuits mounted in electronic products and their packaging more vital to satisfying the above requirements. Ball grid array (BGA) packaging is widely used in the field of microelectronic manufacturing industries due to its multiple I/O volumes and excellent electric characteristics. However, due to environmental loads such as vibration and impact during its production and application, defects inevitably emerge in BGA solder joint defects, which will lead to the failure of electronic products. This article summarizes the state-of-the-art research on the factors, analysis methods, and models for the fatigue failure of BGA chips. After rigorous discussions concerning this research, some theoretical suggestions are provided for BGA packaging in reliability analysis and the establishment of evaluation standards.

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Effects of varying amplitudes on the fatigue life of lead free solder joints

Cited by 25 publications

References 5 publications

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions

Survey on Fatigue Life Prediction of BGA Solder Joints

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