2014
DOI: 10.1080/10426914.2013.872268
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Effects of Ultrasonic Vibration and Magnetic Field in Micro-EDM Milling of Nonmagnetic Material

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Cited by 56 publications
(16 citation statements)
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“…The effect of tool rotation not only disturbs the plasma but also affects the final shape and form of channel. Jafferson et al [18] studied and compared the MRR and TWR with ultrasonic vibration and magnetic field separately and simultaneously. To achieve high MRR, they recommended that to use it separately.…”
Section: Introductionmentioning
confidence: 99%
“…The effect of tool rotation not only disturbs the plasma but also affects the final shape and form of channel. Jafferson et al [18] studied and compared the MRR and TWR with ultrasonic vibration and magnetic field separately and simultaneously. To achieve high MRR, they recommended that to use it separately.…”
Section: Introductionmentioning
confidence: 99%
“…The magnetic pinching force can't be ignored in micro-EDM because the smaller the channel radius is and the bigger current is, the larger the pinching force is [24]. Assume that the plasma channel radius is a, the current density in column is j(r), the magnetic induction intensity is B(r), the pressure distribution is P(r), and μ 0 is the magnetic permeability, then the Maxwell's equations in cylindrical coordinates can be expressed as 0 1 d rB r j r r dr (6) The magnetic field distribution in the plasma can be derived as: …”
Section: Plasma Expand Stagementioning
confidence: 99%
“…Lu et al [8] conducted a scratch test on KDP crystal and analyzed the friction coefficient and conditions for brittle-ductile removal for KDP crystal in each crystal direction during the scratching process and examined the subsurface damage in each crystal direction. Based on the research results that ultrasonic vibration has a positive effect on the removal of brittle materials, concluded by many researchers [9][10][11][12], we have also performed Vickers indentation tests and nano-scratch tests with a spherical indenter along the 0°, 45° and 90° orientations on the second harmonic generation (SHG) and third harmonic generation (THG) crystal planes of KDP crystal, and determined their mechanical properties, critical loads and depths of the brittle-ductile transition. [13,14] In this paper, we introduced ultrasonic vibrations onto the indenter during the scratching process using a single-point diamond to visualize and analyze the effect of ultrasonic vibration on the material removal characteristics of KDP crystal.…”
Section: Introductionmentioning
confidence: 99%
“…After the coefficient of the critical depth, Ψ, and the modified scratch constant, C, are determined, the critical depth of the brittle-ductile transition during the scratching process can be predicted and used to guide the selection of cutting parameters to optimize the material removal mode.According to a previous study method of indentation test as in reference[10] that we conducted, the mean values of the mechanical properties of the KDP crystal test-pieces for the (001) crystal plane in this experiment are shown inTable 1.…”
mentioning
confidence: 99%