Effects of ultrasonic assistance on microhole drilling based on Nd:YAG laser trepanning

Shi, Chunhui; Ren, Naifei; Wang, Houxiao; Xia, Kaibo; Wang, Liang

doi:10.1016/j.optlastec.2018.05.003

Cited by 19 publications

(3 citation statements)

References 21 publications

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“…Laser technology has been extensively used in material micro-processing fields due to its ability to focus energy into a small irradiation area within a short pulse duration, and hence lead to material removal, regardless of the mechanical properties of the material [6,7]. In terms of micro-drilling application, laser has shown good performance, and several drilling techniques have been proposed according to the relative movement between the laser beam and the workpiece, such as percussion drilling [2], trepanning [8], and laser helical drilling [9]. Among these drilling schemes, laser trepanning appears to be more competitive due to its flexibility with laser scanning path control, enabling it to make free-form holes with different contours at the hole entrance/exit [3,8].…”

Section: Introductionmentioning

confidence: 99%

“…In terms of micro-drilling application, laser has shown good performance, and several drilling techniques have been proposed according to the relative movement between the laser beam and the workpiece, such as percussion drilling [2], trepanning [8], and laser helical drilling [9]. Among these drilling schemes, laser trepanning appears to be more competitive due to its flexibility with laser scanning path control, enabling it to make free-form holes with different contours at the hole entrance/exit [3,8]. Therefore, the laser trepanning scheme has been widely employed for micro-hole production in various materials, such as superalloy [3,8], titanium alloy [10], tungsten carbide [4], polymers [11], and ceramics [12].…”

Section: Introductionmentioning

confidence: 99%

“…Among these drilling schemes, laser trepanning appears to be more competitive due to its flexibility with laser scanning path control, enabling it to make free-form holes with different contours at the hole entrance/exit [3,8]. Therefore, the laser trepanning scheme has been widely employed for micro-hole production in various materials, such as superalloy [3,8], titanium alloy [10], tungsten carbide [4], polymers [11], and ceramics [12].…”

Section: Introductionmentioning

confidence: 99%

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Performance Evaluation and Comparison between Direct and Chemical-Assisted Picosecond Laser Micro-Trepanning of Single Crystalline Silicon

Zhu

Zhang

et al. 2018

Materials

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The fabrication of micro-holes in silicon substrates that have a proper taper, higher depth-to-diameter ratio, and better surface quality has been attracting intense interest for a long time due to its importance in the semiconductor and MEMS (Micro-Electro-Mechanical System) industry. In this paper, an experimental investigation of the machining performance of the direct and chemical-assisted picosecond laser trepanning of single crystalline silicon is conducted, with a view to assess the two machining methods. The relevant parameters affecting the trepanning process are considered, employing the orthogonal experimental design scheme. It is found that the direct laser trepanning results are associated with evident thermal defects, while the chemical-assisted method is capable of machining micro-holes with negligible thermal damage. Range analysis is then carried out, and the effects of the processing parameters on the hole characteristics are amply discussed to obtain the recommended parameters. Finally, the material removal mechanisms that are involved in the two machining methods are adequately analyzed. For the chemical-assisted trepanning case, the enhanced material removal rate may be attributed to the serious mechanical effects caused by the liquid-confined plasma and cavitation bubbles, and the chemical etching effect provided by NaOH solution.

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