Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)

Heterogeneous 2.5D integration on through silicon interposer

“…Without compromising processing speed, the integration of multi-chips in one interposer on the package tends to generate higher heat density, which needs to be addressed in the 2.5D or 3D package design. [102][103][104][105][106][107][108][109][110][111][112][113][114][115] A schematic of the cooling concepts is illustrated in Figure 50.…”

“…Specifically, their resistances vary to different extents with respect to different stress components. When a p-MOSFET is oriented along the [110] direction and is placed in between TSVs which are formed along the h110i directions in a rectangular manner, it is found to be more susceptible to mobility change than an n-MOSFET no matter how the n-MOSFET is oriented. This scenario is demonstrated in Figure 84.…”

“…127 At these positions, placement of p-MOSFETs should in fact be avoided. N-MOSFETs oriented along [110] are better devices to be placed at these locations since their mobility change will be negligible (<1%). Active devices, therefore, should be allocated strategically so as to minimize their change in electrical performance when they are placed near the TSVs.…”

Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application

“…The technology paradigm of the semiconductor industries has shifted to 3D integration in all devices, interconnects, vias may be more efficient for the cooling of hot-spots than for whole device cooling (Cho and Lee 2010;Lau and Yue 2012). For whole device cooling, liquid cooling methods are potentially the most effective type of method to remove heat; however, the liquid cooling methods for IC devices have extreme system complexity due to the necessity of a high pumping power of coolant through a microchannel (Lau and Yue 2012), fluidic interconnection, and the complete sealing of the coolant; there is also the problem of high fabrication cost.…”

“…For whole device cooling, liquid cooling methods are potentially the most effective type of method to remove heat; however, the liquid cooling methods for IC devices have extreme system complexity due to the necessity of a high pumping power of coolant through a microchannel (Lau and Yue 2012), fluidic interconnection, and the complete sealing of the coolant; there is also the problem of high fabrication cost. Even so, the demand for a direct liquid cooling method is increasing continuously as one of the key future thermal methods because of the high heat removal rate that is possible.…”