Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

Ho, Li-Ngee; Nishikawa, Hiroshi; Natsume, Naohide; Takemoto, Tadashi; Miyake, Koichi; Fujita, Masakazu; Ota, Koyu

doi:10.1007/s11664-009-0946-5

Cited by 23 publications

(8 citation statements)

References 29 publications

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“…Cu could be one of the most promising candidates for low cost electrically conductive fillers, due to its low resistivity, low cost, and reduced electromigration compared to Ag (36,138). Other low cost electrically conductive fillers have also been developed to replace Ag for ICAs, including solder particles (59,139), a mixture of solder and Cu (59), Cu alloys (57,140,141), Cu coated with a thin layer of low melting point metals, Pb-free metals (such as Sn, In, Bi, Sb, Zn, and their alloys) (62), and Ag-coated Cu fillers (37)(38)(39)(141)(142)(143). The challenge associated with ICAs filled with the low cost conductive fillers lies in the oxidation and corrosion of the filler particles during curing and reliability tests.…”

Section: Low Cost Icasmentioning

confidence: 99%

“…The improvement was attributed to the protection of Cu flakes from oxidation by SCA during the curing at 150 • C. However, the developed ICAs showed a significant increase in bulk resistivity, from 1.28 × 10 − 3 to 3.00 × 10 − 3 ·cm during 85 • C/85% RH aging for only 24 h. Cu readily oxidizes even at low temperatures and cannot form a self-protective layer to prevent further oxidation (144,145). Recently, Ho and co-workers investigated the properties of ICAs filled with Cu and Cu alloyed with Ag, Ge, Mg, and Zn in terms of electrical conductivity, thermal stability, and the effects of the trace alloy elements on the oxidation resistance of the metallic fillers (141). The ICAs filled with these fillers showed similar electrical conductivity after curing.…”

Section: Low Cost Icasmentioning

confidence: 99%

“…To enhance oxidation resistance of Cu particles, the effect of coating Cu particles with Ag has been investigated (37)(38)(39)(141)(142)(143). Lin and Chiu reported that a Ag coating on Cu flakes provided good oxidation resistance at temperatures lower than 175 • C (38).…”

Section: Low Cost Icasmentioning

confidence: 99%

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Conductive Polymer Composites

Zhang

Agar

Wong

2011

Encyclopedia of Polymer Science and Technology

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Insulating polymer materials can be made electronically conductive through the incorporation of electrically conductive fillers. These composite materials are called electrically conductive polymer composites. This article reviews a special class of conductive polymer composites—isotropically conductive adhesives (ICAs). We summarize recent advances in ICA technologies and its application as a lead‐free alternative to metal solders. We discuss how the properties of ICA can be engineered for electronic packaging in terms of material properties, conductive mechanisms, bulk conductivity, adhesion, reliability, and cost. We conclude with a discussion of commercial processes for ICA use in consumer electronics.

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Section: Low Cost Icasmentioning

confidence: 99%

Section: Low Cost Icasmentioning

confidence: 99%

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Conductive Polymer Composites

Zhang

Agar

Wong

2011

Encyclopedia of Polymer Science and Technology

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“…Generally, a combination of three different groups, which are conductive filler, polymer binder, and volatile and non-volatile organic polymer, will develop ready-to-use stretchable conductive ink [23]. Conductive filler had been extensively studied for example carbonous-based material (such as graphene [24], carbon nanotube (CNT) [25] and metallic material (such as copper [26,27], silver [22,28,29]). For this study, silver was chosen due to amongst all the conductive fillers, silver exhibit robust and excellent conductivity with sheet resistance typically 0.01-0.04 Ω/sq at dry thickness 25 µm of ink layer [22] as well as have good chemical durability [28].…”

Section: Introductionmentioning

confidence: 99%

Temperature Dependence on Silver Conductivity and Adhesion Performance Between Silver and Flexible Substrate

Yunos

Omar

Salim

et al. 2020

ARFMTS

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The improper discard practice of printed circuit board (PCB) leads to human health and environmental problems. Although the study had been done to improve the recycling process of E-waste, awareness from various parties needs more effort for this improved recycling process to successfully implement. Therefore, an alternative way by substitute the conventional PCB with the new flexible PCB can help eliminate these issues. The basic design of a flexible PCB consists of a flexible base and conductor. However, a key point during the developing of this new technology is the adhesion between the flexible base and conductor, which thermoplastic polyurethane (TPU) as the base, while silver as the conductor was used throughout this study. This paper presents the effect of temperature in improving adhesion between substrate and silver, and concurrently influence the electrical conductivity of silver conductor. In this study, the characterization of silver and substrate respected to temperature individually analysed, followed by the qualitative adhesion observation between silver and substrate was carried out through cross-cut test according to ASTM D3359-09. The silver was exposed to different curing temperatures exhibit lower sheet resistance when temperature increase. Meanwhile, the substrate exposed to a temperature higher than glass transition (Tg) increases improve the adhesion between silver and substrate.

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“…Among the various conducting particles, Ag is the most commonly used because it exhibits the largest electrical conductivity, high-thermal conductivity, and chemical durability. It also possesses the lowest contact resistance [6][7][8][9]. However, Ag is relatively expensive.…”

Section: Introductionmentioning

confidence: 99%

Properties of Single and Hybrid Aluminum and Silver Fillers Filled High-Density Polyethylene Composites

Hidayah

Mariatti

2011

Journal of Thermoplastic Composite Materials

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The electrical and thermal properties of two series of composites, single-filler aluminum (Al) and silver (Ag) and hybrid-filler Al/Ag-filled high-density polyethylene (HDPE) composites, are reported. The composites were prepared by mixing using an internal mixer followed by compression molding. Studies on the electrical properties of single-filler composites showed an insulator-to-conductor transition in HDPE/Ag and HDPE/Al between 45-55 wt% and 55-65 wt% filler loadings, respectively. This is due to the formation of conductive paths that spanned throughout the polymer matrix, as revealed by morphology study. Thermogravimetric analysis results indicated that the degradation temperature of the composites decreased with the incorporation of 15 wt% Al-and Ag-fillers but increased slightly after the addition of 55 wt% of the filler. Investigation on the effect of hybrid composites showed that high-electrical conductivity was achieved, exhibiting percolation phenomenon in HDPE/80Ag20Al and HDPE/70Ag30Al composites where in these composites, 20% and 30% from 55 wt% of Ag were replaced with Al fillers, respectively. Furthermore, thermal stability significantly increased when hybridization was conducted to form the composite.

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Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

Cited by 23 publications

References 29 publications

Conductive Polymer Composites

Conductive Polymer Composites

Temperature Dependence on Silver Conductivity and Adhesion Performance Between Silver and Flexible Substrate

Properties of Single and Hybrid Aluminum and Silver Fillers Filled High-Density Polyethylene Composites

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