Effects of the On-Die Decoupling Capacitors on the EME Performance in 28 nm FD-SOI Technology

Rotigni, Mario; Merlo, Mauro; Sanna, Aurora; Colombo, Paolo; Castellan, Renato; Liberali, V.; Barletta, Andrea; DeChecchi, Roberto; Skytte, Kristoffer Sander

doi:10.1109/emccompo.2019.8919707

2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) 2019

DOI: 10.1109/emccompo.2019.8919707

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Effects of the On-Die Decoupling Capacitors on the EME Performance in 28 nm FD-SOI Technology

Mario Rotigni

Mauro Merlo

Aurora Sanna

et al.

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Cited by 3 publications

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IC-package Optimization for Conducted EME Performance: Impact of Discrete Decoupling Capacitors and Parasitic Inductive Effects

Sanna

Graziosi

2021

2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

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Effects of the On-Die Decoupling Capacitors on the EME Performance in 28 nm FD-SOI Technology

Cited by 3 publications

References 2 publications

IC-package Optimization for Conducted EME Performance: Impact of Discrete Decoupling Capacitors and Parasitic Inductive Effects

IC-package Optimization for Conducted EME Performance: Impact of Discrete Decoupling Capacitors and Parasitic Inductive Effects

Impact on Signal Integrity and Radiated Emissions of Two-Layer vs Four-Layer BGA Package Technology for Automotive Applications

Optimized Power Delivery Performance Using Plane Terminations

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