Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint

Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin

doi:10.1016/j.jallcom.2020.155006

Cited by 16 publications

(3 citation statements)

References 49 publications

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“…The difference between the P-type and N-type interfacial behaviors is that the Sb elements in the P-type TE leg diffuse into the Sn layer in addition to the Te. The above phenomenon is consistent with previous reports. , Accordingly, it can be assumed that changes in soldering pressure do not lead to changes in the elemental composition and phases of the interface layer.…”

Section: Resultssupporting

confidence: 92%

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Soldering Pressure Effect on Lifetime of Thermoelectric Modules under Thermal Cycling

Zhang,

He,

Niu

et al. 2024

ACS Appl. Mater. Interfaces

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For practical industrial applications, enhancing the longevity and the reliability of thermoelectric modules (TEMs) is equally as crucial as improving their conversion efficiency. This study proposes a strategy for extending the lifespan and introduces the quality evaluation criteria for the most extensively used commercial bismuth telluride TEM. By varying the soldering pressure during module assembly, its impact on the quality of the module’s internal interfacial connections was investigated, via analyzing its contact resistivity, shear modulus, and antifatigue ability through thermal cycling tests. The findings reveal that increasing the soldering pressure leads to a slight reduction in interfacial contact resistivity and has no significant effect on the shear modulus but notably enhances the module’s antifatigue ability during thermal cycling tests. According to the SEM results, it can be evidently deduced that the aforementioned phenomena are directly correlated with the size and quantity of voids distributed in the solder layer, which is regarded as the origin of antifatigue ability. Thus, it can be inferred that augmenting the soldering pressure represents an effective approach to prolonging the lifespan of TEMs assembled by using the soldering method. Furthermore, the existence of voids within the solder layer can serve as a criterion for an initial assessment of module longevity. This study provides a reference for both the industrial assembly and lifespan evaluation of commercial bismuth telluride TEMs.

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Section: Resultssupporting

confidence: 92%

“…The above phenomenon is consistent with previous reports. 38,39 Accordingly, it can be assumed that changes in soldering pressure do not lead to changes in the elemental composition and phases of the interface layer.…”

Section: Causes Analysismentioning

confidence: 99%

Soldering Pressure Effect on Lifetime of Thermoelectric Modules under Thermal Cycling

Zhang,

He,

Niu

et al. 2024

ACS Appl. Mater. Interfaces

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“…To prevent the interfacial reactions between solder and TE materials, a thin diffusion barrier, such as electrodeposited Ni, is introduced onto the soldering plane of TE materials. In recent years, extensive investigations have been conducted on the correlated interfacial reactions of lead-free solders/diffusion barriers/TE materials [9][10][11][12][13][14][15]. Electroless nickel/immersion gold (ENIG) and electroless nickel/electroless palladium/immersion gold (ENEPIG) are commonly used surface finishing processes for the diffusion barrier.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material

Wang,

Chiu,

2024

Materials

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This study investigated the interfacial reactions between n-type Bi2(Te,Se)3 thermoelectric material, characterized by a highly-oriented (110) plane, and pure Sn and Sn-3.0Ag-0.5Cu (wt.%) solders, respectively. At 250 °C, the liquid-state Sn/Bi2(Te,Se)3 reactions resulted in the formation of both SnTe and BiTe phases, with Bi-rich particles dispersed within the SnTe phase. The growth of the SnTe phase exhibited diffusion-controlled parabolic behavior over time. In contrast, the growth rate was considerably slower compared to that observed with p-type (Bi,Sb)2Te3. Solid-state Sn/Bi2(Te,Se)3 reactions conducted between 160 °C and 200 °C exhibited similar interfacial microstructures. The SnTe phase remained the primary reaction product, embedded with tiny Bi-rich particles, revealing a diffusion-controlled growth. However, the BiTe layer had no significant growth. Further investigation into growth kinetics of intermetallic compounds and microstructural evolution was conducted to elucidate the reaction mechanism. The slower growth rates in Bi2(Te,Se)3, compared to the reactions with (Bi,Sb)2Te3, could be attributed to the strong suppression effect of Se on SnTe growth. Additionally, the interfacial reactions of Bi2(Te,Se)3 with Sn-3.0Ag-0.5Cu were also examined, showing similar growth behavior to those observed with Sn solder. Notably, compared with Ag, Cu tends to diffuse towards the interfacial reaction phases, resulting in a high Cu solubility within the SnTe phase.

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Realizing a Superior Conversion Efficiency of ≈11.3% in the Group IV‐VI Thermoelectric Module

Cheng,

Yin,

Wang

et al. 2024

Small

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GeTe‐based materials exhibit superior thermoelectric performance, while the development of power generation devices has mainly been limited by the challenge of designing the interface due to the phase transition in GeTe. In this work, via utilizing the low‐temperature nano‐Ag sintering technique and screening suitable Ti‐Al alloys, a reliable interface with excellent connection performance has been realized. The Ti‐Al intermetallic compounds effectively inhibit the diffusion process at Ti‐34Al/Ge0.9Sb0.1Te interface. Thus, the thickness of the interfacial reaction layer only increases by ≈2.08 µm, and the interfacial electrical contact resistivity remains as low as ≈15.2 µΩ cm2 even after 30 days of isothermal aging at 773 K. A high conversion efficiency of ≈11.3% has been achieved in the GeTe/PbTe module at a hot‐side temperature of 773 K and a cold‐side temperature of 300 K. More importantly, the module's performance and the reliability of the interface remain consistently stable throughout 50 thermal cycles and long‐term aging. This work promotes the application of high‐performance GeTe materials for thermoelectric power generation.

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Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint

Cited by 16 publications

References 49 publications

Soldering Pressure Effect on Lifetime of Thermoelectric Modules under Thermal Cycling

Soldering Pressure Effect on Lifetime of Thermoelectric Modules under Thermal Cycling

Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material

Realizing a Superior Conversion Efficiency of ≈11.3% in the Group IV‐VI Thermoelectric Module

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