2010
DOI: 10.1016/j.egypro.2010.07.011
|View full text |Cite
|
Sign up to set email alerts
|

Effects of the front surface field in n-type interdigitated back contact silicon heterojunctions solar cells

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

1
9
1

Year Published

2012
2012
2023
2023

Publication Types

Select...
7
1
1

Relationship

0
9

Authors

Journals

citations
Cited by 22 publications
(11 citation statements)
references
References 10 publications
1
9
1
Order By: Relevance
“…Eventually, our findings are not in direct contradiction with earlier published results in which the presence of an FSF was indicated as a requirement 1) for efficient lateral transport of the photogenerated carriers and 2) for low surface recombination velocities [53], [55]. Both mentioned effects indeed depend on the passivation quality provided in absence of the front n-type a-Si:H layer, through the substrate injection level in case 1 and directly in case 2.…”
Section: High-j Sc Interdigitated Back-contacted Silicon Heterojuncontrasting
confidence: 57%
“…Eventually, our findings are not in direct contradiction with earlier published results in which the presence of an FSF was indicated as a requirement 1) for efficient lateral transport of the photogenerated carriers and 2) for low surface recombination velocities [53], [55]. Both mentioned effects indeed depend on the passivation quality provided in absence of the front n-type a-Si:H layer, through the substrate injection level in case 1 and directly in case 2.…”
Section: High-j Sc Interdigitated Back-contacted Silicon Heterojuncontrasting
confidence: 57%
“…As far as the RE-SHJ sensitivity to front-side passivation is concerned, such cells behave like rear contacted cells [25]. Up to now, our best cell results have been achieved with a front (i)a-Si:H/(n)aSi:H layer stack of 4.5 nm each.…”
Section: B Bulk A-si:h Defectsmentioning
confidence: 95%
“…Thickness dsio2 = 5 nm [11] Emitter finger (a-Si:H p + ) width WBSF = 500 μm [2] Thickness dBSF = 10 μm carrier concentration NAaSi = 8 × 10 18 cm -3 [12] Energy band gap EgaSi = 1.7 eV [3] Electron affinity χaSi = 3.8 eV [3] Effective density of state conduction band edge NCaSi = 4.5 × 10 21 cm -3 [13] Effective density of state valance band edge NVaSi = 6.4 × 10 21 cm -3 [13] Drift mobility of electron μnaSi = 1 cm 2 /Vs [13] Drift mobility of hole μpaSi = 0.01 cm 2 /Vs [13] electron lifetime τnaSi = 900μs [14] Back surface recombination velocity SBSF = 10 cm/s [15] BSF finger (a-Si:H n + )/FSF2 width Wemitter = 150 μm [2] Thickness demitter = 6 μm carrier concentration NDaSi = 5 × 10 19 cm -3 [12] Energy band gap EgaSi = 1.72 eV [3] Electron affinity χaSi = 3.7 eV [3] Relative permittivity εcSi = 6 [12] Effective density of state conduction band edge NCaSi = 4.5 × 10 21 cm -3 [13] Effective density of state valance band edge NVaSi = 6.4 × 10 21 cm -3 [13] Drift mobility of electron μnaSi = 1 cm 2 /Vs [13] Drift mobility of hole μpaSi = 0.01 cm 2 /Vs [13] hole lifetime τpaSi = 700μs [14] Back surface recombination velocity Semitter = 10 cm/s [15] c-Si n-type substrate (bulk)…”
Section: Introductionmentioning
confidence: 99%