Effects of Temperature and Humidity Treatment Conditions on the Interfacial Adhesion Energy between the Electroless-Plated Ni and Polyimide

Abstract

The effect of temperature/humidity treatment conditions on the interfacial adhesion energy between an electroless-plated Ni film and a polyimide substrate was evaluated by using a 180° peel test. The measured peel strength values decrease from 506.1 ±18.6 to 231.9 ±33.3 J/m2 due to the temperature/humidity treatment at 85 °C/85% relative humidity for 1000 h. X-ray photoelectron spectroscopy analysis of the peeled surfaces indicates that peeling occurs cohesively inside of the polyimide; this is related to both the decrease in the interfacial adhesion energy and the polyimide degradation when small quantities of the remaining alkali ions react with the polyimide's functional groups during the temperature/humidity treatment.

Effects of High Temperature Immersion on Interfacial Adhesion between Polypropylene and Nickel Substrate

“…Therein, it is worth noting that the decrease prior to 12 h mostly occurred at the first 6 h because the rate of descending of the first 6 h is faster than the following rate from 6 h to 12 h. Afterward, in the second stage from 12 h to 18 h, there existed slight recovery from 2.54 ± 0.02 to 2.64 ± 0.03 N/mm. In the last 6 h of 1 day, the adhesive strength maintained in a steady state and continued to 72 h. In comparison, as inserted in Figure , the red dash line representing the adhesive strength of polyimide/Ni treated at 85 °C/85% RH is similar to the black curve of PP/Ni in the present study. However, it is obvious that the red dash line is only made up of two processes except the recovery.…”

“…Variation of adhesive strength of immersion in prepared sample solution ( V DMC / V EC = 1/1, C LiPF6 = 1 mol/L) as a function of time (the inserted red dash line presenting the adhesive strength of polyimide/Ni treated at 85 °C/85% RH ).…”

“…As a matter of fact, the mutual interaction of temperature and moisture could induce severer degradation than either respective effects. , Park et al conducted an experiment to investigate interfacial adhesion properties of electroless-plated Ni/polyimide specimens exposed in a thermal humidity chamber at 85 °C in 85% RH. With aging periods increasing, the peeling strength sharply decreased before the 168h treatment, then going into steady state for longer time.…”

Interfacial Adhesion Energy of Ru–AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru–AlO Thin Film

“…These surface cracks are assumed to be closely tied to the interfacial adhesion. 19,20) XPS scans were performed on both sides of the delaminated surface after the four-point bending test to establish the fracture path. I shows the relative atomic concentrations on the upper and lower sides of the wafer as determined by XPS.…”

Physical chemical properties of polyimide palladium nano - composite membranes

“…the 20 minute NaOH treatment sample. Using a 180° peel test, Park et al found that a nickel plated polyimide film had a much higher value of 0.51 ± 0.01 N/mm [11]. The differences can be attributed to the methodologies used in pre-treating the membrane, electroless plating, and peel test preparation.…”