2006
DOI: 10.1103/physrevstab.9.062001
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Effects of surface damage on rf cavity operation

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Cited by 35 publications
(30 citation statements)
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“…Our previous OOPIC simulations 1 showed that the copper surface can become very hot as a result of ion bombardment within a few nanoseconds in close vicinity to the plasma and can be melted. Therefore, a liquid Cu surface for MD simulation was prepared by heating a copper substrate to the melting temperature of 1310 K, equilibrating this configuration, and storing it as an input file for the sputtering yield calculations.…”
Section: Self-sputtering Of Solid and Liquid Copper Surfacesmentioning
confidence: 99%
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“…Our previous OOPIC simulations 1 showed that the copper surface can become very hot as a result of ion bombardment within a few nanoseconds in close vicinity to the plasma and can be melted. Therefore, a liquid Cu surface for MD simulation was prepared by heating a copper substrate to the melting temperature of 1310 K, equilibrating this configuration, and storing it as an input file for the sputtering yield calculations.…”
Section: Self-sputtering Of Solid and Liquid Copper Surfacesmentioning
confidence: 99%
“…The ion energies were selected between 50 and 150 eV, corresponding to the sheath potential value obtained by our OOPIC simulation. Figure 1 shows the results of our MD simulations of self-sputtering of the copper rf-cavity surface by accelerated Cu+ ions, at ion energies varied between 50 and 150 eV and surface temperatures of 300-1310 K. The 1 To be published elsewhere ID 441 3 most important result is that the self-sputtering yield at 800 K for an ion energy of 100 eV was found to be approximately 2.5 and increases as the melting point of 1310 K is reached.…”
Section: Self-sputtering Of Solid and Liquid Copper Surfacesmentioning
confidence: 99%
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“…An earlier paper has shown that all structures seem to break down at a fixed value of E local and any variation in the gradient limits must be due to the maximum enhancement factors in specific structures [14]. As the basic processes in all rf arcs follow similar mechanisms, and the primary difference between the particular structures is due to the energy of the arc.…”
Section: Gradient Limitsmentioning
confidence: 99%