Effects of strain rates and biaxial stress conditions on plastic yielding and flow stress of solder alloys

Liang, Juan; Dariavach, N.; Barr, Guy; Fang, Zhen

doi:10.1007/bf02692459

Cited by 10 publications

(5 citation statements)

References 2 publications

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“…There have been many studies dedicated to the study of the mechanical properties of lead-free solder materials, including studies looking at tensile properties, creep, and fatigue, under different conditions [15][16][17][18][19][20][21].…”

Section: Introductionmentioning

confidence: 99%

Determination of thermo-electrical properties in Sn based alloys

et al. 2010

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The variation of thermal conductivity of solid phase versus temperature for Sn-21 wt.% Bi, Sn-25 wt.% In and Sn-35 wt.% In-26 wt.% Bi alloys were measured with a radial heat flow apparatus. From the graphs of thermal conductivity versus temperature, the thermal conductivity of the solid phases at their melting temperatures and the thermal temperature coefficients for the same alloys were obtained. The ratios of thermal conductivity of liquid phase to solid phase for the same materials were measured with a Bridgman type directional solidification apparatus. The variations of electrical conductivity of solid phases versus temperature for the same alloys were determined from the Wiedemann-Franz law by using the measured values of thermal conductivity. From the graphs of electrical conductivity versus temperature, the electrical temperature coefficients for the same alloys were also determined. According to present experimental results it can be concluded that the thermal and electrical conductivity of Sn based alloys depend on the thermal and electrical conductivity of the alloying elements. If the thermal and electrical conductivity of the alloying elements are lower than the thermal conductivity of Sn, the thermal conductivity of Sn based alloys decreases, whereas, otherwise, it increases.

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Section: Introductionmentioning

confidence: 99%

Determination of thermo-electrical properties in Sn based alloys

et al. 2010

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“…There are many studies dedicated to the study of mechanical properties of lead-free solder materials, including tensile properties, creep, and fatigue, under different conditions [3][4][5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

The microstructure parameters and microhardness of directionally solidified Sn–Ag–Cu eutectic alloy

Böyük

Maraşlı

2009

Journal of Alloys and Compounds

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“…Compared with SnPb solder, current Sn4AgO.5Cu lead free solder already shows higher solder strength due to Ag3Sn and Cu6Sn5 IMC strengthening in solder bulk. Moreover, according to the study by Liang et al, Sn3.8wt%Ag 0.7wt%Cu solder showed stronger strain rate hardening effect than SnPb one, especially in high strain rate (1.3x10-2 sec-1) [8]. Therefore, both solder strength and strain hardening could help to explain why brittle interface failure became the major failure for Sn4AgO.5Cu lead free solder in drop test and then degrade the reliability.…”

Section: Methodsmentioning

confidence: 94%

Board Level Drop Test and Simulation of CSP for Handheld Application

Jiang

Tzeng

Wang

et al. 2006

2006 7th International Conference on Electronic Packaging Technology

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For CSP used in handheld electronic products, such as mobile phone, PDA, etc., the board level drop test has become a great concern, especially in the stage of lead free transition.Comparison between SnPb and lead free Sn4AgO.5Cu solders, CSP components on board with SnPb solder had much better drop test reliability than lead free one. However, since the drop test is a time-wasting method, the simulation technique is necessary to shorten the design stage and get the optimized solution. In current study, LS-DANA was used to do stress simulation during drop impact. In the beginning, the PCB strain response was compared between modeling and drop test. The result showed good agreement with -maximum 15% deviation. The stress in the solder joint was also analyzed and the high stress area in component side was similar with failure mode confirmed by dye and pry analysis after drop test.The simulation technique was also used to confirm the effect of ball layout on the drop test reliability in this study. In the modeling, the peeling stress decreased with increment in row number of outer solder balls till 3 rows. As row number larger than 3, no big difference was found. In drop test, the result also showed the similar trend. Comparison between 2 and 3 rows, both SnPb and Sn4AgO.5Cu could not pass 30 drops with 2 rows, but 3 rows could effectively improve the reliability to pass 30 drops.

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Effects of strain rates and biaxial stress conditions on plastic yielding and flow stress of solder alloys

Cited by 10 publications

References 2 publications

Determination of thermo-electrical properties in Sn based alloys

Determination of thermo-electrical properties in Sn based alloys

The microstructure parameters and microhardness of directionally solidified Sn–Ag–Cu eutectic alloy

Board Level Drop Test and Simulation of CSP for Handheld Application

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