Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications

Park, Hwan Pil; Seo, Gwancheol; Kim, Sung‐Chul; Kim, Young Ho

doi:10.1007/s11664-017-5883-0

Cited by 13 publications

(6 citation statements)

References 15 publications

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“…The effect of solder volume has been investigated by several researchers to comprehend the IMC thickness at the solder joints [101][102][103][104]. Different solder volumes give rise to different interfacial reactions which in turns affect the formation of interfacial IMC and the microstructure [101].…”

Section: Effect Of Solder Volumementioning

confidence: 99%

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

et al. 2022

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Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to the long-term performance of electronic products. One of the most important factors which are known to influence solder joint reliability is the intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is due to its brittle nature. This paper reviews the formation and growth of IMCs in lead-free solder joints detailing the effect of alloying additions, surface finishes, aging time, aging temperature and solder volume. The formation and growth of the brittle IMCs were significantly affected by these factors and could be possibly controlled. This review may be used as a basis in understanding the major factors effecting the IMC formation and growth and relating it to the reliability of solder joints.

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Section: Effect Of Solder Volumementioning

confidence: 99%

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

et al. 2022

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“…The Cu/Sn system is one of the simplest metallurgical options for solder joints. During the reflow, the IMC layer is formed between the Cu-pad and the solder joint(Zhong and Yi (1999), Gong et al (2008), Kim and Yu (2010); Zhong et al (2010), Kim et al (2009); Tseng and Duh (2013), Yoon et al (2015); Park et al (2018)). The longer the reflow time, the thicker the IMC layer.…”

Section: Primary Factors Influencing the Reliability Of Solder Jointsmentioning

confidence: 99%

Machine learning framework for predicting reliability of solder joints

Jones

2019

SSMT

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Purpose This paper aims to present a machine learning framework for using big data analytics to predict the reliability of solder joints. The purpose of this study is to accurately predict the reliability of solder joints by using big data analytics. Design/methodology/approach A machine learning framework for using big data analytics is proposed to predict the reliability of solder joints accurately. Findings A machine learning framework for predicting the life of solder joints accurately has been developed in this study. To validate its accuracy and efficiency, it is applied to predict the long-term reliability of lead-free Sn96.5Ag3.0Cu0.5 (SAC305) for three commonly used surface finishes such OSP, ENIG and IAg. The obtained results show that the predicted failure based on the machine learning method is much more accurate than the Weibull method. In addition, solder ball/bump joint failure modes are identified based on various solder joint failures reported in the literature. Originality/value The ability to predict thermal fatigue life accurately is extremely valuable to the industry because it saves time and cost for product development and optimization.

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“…The experimental self-alignment of Cu µ-pillars (also called C2 bumps) and standard ball grid array joints (called C4 bumps) has been shown on numerous occasions to exhibit a final misalignment of less than 1 µm following bonding. [9][10][11][12][13][14][15][16][17][18] Through this assembly mechanism, the need for active alignment of optical components can be significantly reduced or eliminated. This is crucial because active alignment increases fabrication time and the overall package cost, which already accounts for over 80% of the total expense for photonic packages.…”

Section: Introductionmentioning

confidence: 99%

High density vertical optical interconnects for passive assembly

Weninger

Otálvaro²,

Jain³

et al. 2023

Optical Interconnects XXIII

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The co-packaging of optics and electronics provides a potential path forward to achieving beyond 50 Tbps top of rack switch packages. In a co-packaged design, the scaling of bandwidth, cost, and energy is governed by the number of optical transceivers (TxRx) per package as opposed to transistor shrink. Due to the large footprint of optical components relative to their electronic counterparts, the vertical stacking of optical TxRx chips in a co-packaged optics design will become a necessity. As a result, development of efficient, dense, and wide alignment tolerance chip-to-chip optical couplers will be an enabling technology for continued TxRx scaling. In this paper, we propose a novel scheme to vertically couple into standard 220 nm silicon on insulator waveguides from 220 nm silicon nitride on glass waveguides using overlapping, inverse double tapers. Simulation results using Lumerical’s 3D Finite Difference Time Domain solver are presented, demonstrating insertion losses below -0.13 dB for an inter-chip spacing of 1 μm; 1 dB vertical and lateral alignment tolerances of approximately 2.6 μm and ± 2.8 μm, respectively; a greater than 300 nm 1 dB bandwidth; and 1 dB twist and tilt tolerances of approximately ± 2.3 degrees and 0.4 degrees, respectively. These results demonstrate the potential of our coupler for use in co-packaged designs requiring high performance, high density, CMOS compatible out of plane optical connections.

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Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications

Cited by 13 publications

References 15 publications

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

Machine learning framework for predicting reliability of solder joints

High density vertical optical interconnects for passive assembly

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