Effects of Sn addition on the microstructure and properties of Bi–11Ag high-temperature solder

Yin, Limeng; Dong, Li; Zhang, Yao; Wang, Gang; Das, Diganta; Pecht, Michael

doi:10.1007/s10854-018-9308-5

Cited by 7 publications

(2 citation statements)

References 18 publications

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“…In this article [34], a new high-temperature solderable gold Bi-11Ag with Sn addition of 1.3-5 wt.% was developed. The results show that the melting temperature of Bi-11Ag solder dropped from 265 to 255 • C after the addition of Sn.…”

Section: Introductionmentioning

confidence: 99%

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

et al. 2023

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This research aimed to study a Bi–Ag–Mg soldering alloy and the direct soldering of Al2O3 ceramics and Ni–SiC composites. Bi11Ag1Mg solder has a broad melting interval, which mainly depends on the silver and magnesium content. The solder starts to melt at a temperature of 264 °C. Full fusion terminates at a temperature of 380 °C. The microstructure of the solder is formed by a bismuth matrix. The matrix contains segregated silver crystals and an Ag (Mg, Bi) phase. The average tensile strength of solder is 26.7 MPa. The boundary of the Al2O3/Bi11Ag1Mg joint is formed by the reaction of magnesium, which segregates in the vicinity of a boundary with a ceramic substrate. The thickness of the high-Mg reaction layer at the interface with the ceramic material was approximately 2 μm. The bond at the boundary of the Bi11Ag1Mg/Ni–SiC joint was formed due to the high silver content. At the boundary, there were also high contents of Bi and Ni, which suggests that there is a NiBi3 phase. The average shear strength of the combined Al2O3/Ni–SiC joint with Bi11Ag1Mg solder is 27 MPa.

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Section: Introductionmentioning

confidence: 99%

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

et al. 2023

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“…In the present work, we focus on active solder alloys on the basis of eutectic Ag-Bi, an alloy system with an equilibrium eutectic temperature of 262.5°C [40]. The potential of Bi-Ag alloys as a substitute material for Pb-containing solders for high soft soldering temperature applications has been demonstrated by various authors [41][42][43][44][45][46][47][48][49][50][51]. Furthermore, Koleň ák et al [25] and Šuryová et al [52] showed the possibility of joining ceramics (Al 2 O 3 and SiC) with Cu using Bi-Ag-based alloys with small additions of La and Ti as active elements; these authors used ultrasound to enhance wetting during the soldering process.…”

Section: Introductionmentioning

confidence: 99%

Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders

Weber

Rettenmayr

2020

J Mater Sci

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Active brazing is a commonly used method for joining dissimilar materials with at least one non-metallic component. In the present study, joining of SiO2 glass to 316L stainless steel was performed utilizing Bi–Ag-based solders. Ti up to a concentration of 4 and Mg up to 1 wt.% were added as active elements. Microstructures of the solder alloys in the as-cast state and of cross sections of the joined compounds were analysed using scanning electron microscopy and energy-dispersive X-ray spectroscopy. In the as-cast state of the solder, Ti is found in Bi–Ti intermetallic phases; Mg is partially dissolved in the fcc-(Ag) phase and additionally contained in a ternary Ag-Bi-Mg phase. After soldering, a tight joint was generated using several alloy compositions. Ti leads to the formation of reaction products at the steel/solder and glass/solder interfaces, and Mg is exclusively accumulated at the glass/solder interface.

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The effect of temperature gradient on interfacial Cu6Sn5 growth during thermal compression bonding

Sun

Guo

2019

J Mater Sci: Mater Electron

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Effects of Sn addition on the microstructure and properties of Bi–11Ag high-temperature solder

Cited by 7 publications

References 18 publications

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

Joining of SiO2 glass and 316L stainless steel using Bi–Ag-based active solders

The effect of temperature gradient on interfacial Cu6Sn5 growth during thermal compression bonding

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