Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders

El-Daly, A.A.; Hammad, A.E.

doi:10.1016/j.msea.2010.04.078

Cited by 51 publications

(33 citation statements)

References 32 publications

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“…Low melting points, suitable mechanical properties, and relatively low costs characterize the Sn-Zn alloys [5][6][7][8] , when compared with others lead-free solder alloys. However, the eutectic Sn-9wt.%Zn alloy has displayed drawbacks as poor wettability and oxidation phenomenon.…”

Section: Introductionmentioning

confidence: 99%

“…However, the eutectic Sn-9wt.%Zn alloy has displayed drawbacks as poor wettability and oxidation phenomenon. The addition of alloying elements, such as Ag, Cu, Bi improved such characteristics as well as mechanical properties [5][6][7][8] . It is known that the microstructural features (formation of phases, intermetallics, morphology, distribution and length-scale) may be affected by cooling thermal parameters during process (growth rate-V and cooling rate-Ṫ) 9,10 .…”

Section: Introductionmentioning

confidence: 99%

“…By examining the aforementioned findings concerning microstructure and mechanical properties in Sn-ZnCu [5][6][7][8]11 , correlations between the local length scales of the microstructure of the Sn-9Zn-Cu alloys, the formed IMCs and tensile properties are still undetermined in literature.…”

Section: Introductionmentioning

confidence: 99%

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Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Silva

Spinelli

2018

Mat. Res.

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The microstructure length-scales (dendritic and eutectic), morphologies and tensile properties of a ternary Sn-9wt.%Zn-2wt.%Cu alloy are compared with those of a binary eutectic Sn-9wt.%Zn alloy. The following experimental/analytical steps were performed: transient directional solidification experiments of the Sn-9wt.%Zn-2wt.%Cu alloy; measurements of secondary dendrite arm (λ 2 ) and interphase spacing (λ); morphology of the eutectic α-Zn phase; determination of thermal parameters such as cooling rate (Ṫ L ) and their evolutions during solidification; and, finally, interrelations of microstructure vs. tensile properties. The addition of 2wt.%Cu causes significant refinement of the eutectic structure. Hall-Petch type experimental expressions outlined the variations of strength and ductility with both λ 2 and λ. Very fine Zn globules and needles forming the eutectic in the ternary alloy seems to cause a reversal on ductility behavior, as compared to the tendency observed for the binary Sn-9wt.%Zn alloy. Here, for the ternary Sn-9wt.%Zn-2wt.%Cu alloy ductility increases with decreasing interphase spacing.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Silva

Spinelli

2018

Mat. Res.

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“…The Sn-9Zn alloy, the most preferred soldering alloy in recent years, stands out with its aspects such as having a melting temperature (198.5 • C) close to traditional Sn37Pb alloy, low cost, good mechanical properties, and not causing any damage to human health and environment [13][14][15][16][17]. However, the alloy has low wettability and corrosion resistance due to easy oxidation of Zn, which is an active element [18][19][20][21]. For this reason, third and fourth alloy elements must be added to the Sn-Zn soldering alloy in order to increase use of alloy systems [22][23][24][25].…”

Section: Introductionmentioning

confidence: 99%

An Investigation of Microstructure and Mechanical Properties of Sn-9Zn-xCr Alloys Produced by Investment Casting Method

Yavuzer

Özyürek

2017

Acta Phys. Pol. A

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In this study, the microstructure and mechanical properties were investigated of different amount Cr (0.1%, 0.5%, 0.9%) added Sn-9Zn eutectic alloys and Weibull statistical analyses were evaluated using ultimate tensile strength. Pure elements (Sn, Zn, Cr) were used for production of alloys and pre-alloying was done and waited in the electrical resistance furnace at 450 • C for 1 h to homogenized and poured as ingot in plaster moulds. Then pre-alloyed Sn-9Zn-xCr ingots were melted and poured at 300 • C in ceramic moulds prepared investment casting method. As a result of the study, the highest hardness and ultimate tensile strength values were measured in the Sn-9Zn alloy with 0.1% Cr. It was determined that while ultimate tensile strength was decreased, percentage of elongation was increased by increase of Cr amount. According to the Weibull statistical analyses results, the highest Weibull module was calculated by Sn-9Zn-0.1Cr alloy ultimate tensile strength values.

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“…Currently, the ternary eutectic Sn-Ag-Cu (SAC) solder alloys seem to be the most promising candidate for replacement of Pb-containing solders (El-Daly & Hammad 2010). The addition of Cu slightly depresses the melting temperature of Sn-Ag and increases the wetting behavior (Kim et al 2003).…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Fayeka¹,

Haseeb²,

Fazal³

2017

JSM

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Sn-Ag based solder alloy seems to be a promising lead-free solder for the application on electronic assembly. The corrosion behavior of different lead free solder alloys such as Aloi pateri berasaskan Sn-Ag berpotensi menjadi pateri bebas-Pb untuk diaplikasikan sebagai pemasangan elektronik. Tindak balas kakisan aloi pateri bebas Pb yang berbeza seperti dikaji dalam larutan 3.5% NaCl menggunakan upaya dinamik pengutuban dan spektroskopi impedans elektrokimia. Mikroskop imbasan elektron (SEM), spektroskopi sinar-X tenaga terserak (EDX) dan pembelauan sinar-X (XRD) telah digunakan

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Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders

Cited by 51 publications

References 32 publications

Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

An Investigation of Microstructure and Mechanical Properties of Sn-9Zn-xCr Alloys Produced by Investment Casting Method

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

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