Effects of Sintering Process Conditions on Size Shrinkages of Low-Temperature Co-Fired Ceramic Substrate

Zhong, Zhang; Arulvanan, P.; Ang, C. L.

doi:10.1080/10426910600727833

Cited by 11 publications

(5 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…, and is identical to that obtained by Fang and Zhang 16 with M ¼ 0 and by Yacob and Ishak 21 with K ¼ 0. The comparison of the flow velocity f 0 ð Þ obtained by FEM and by analytical method from equation ( 28) is tabulated in Table 2.…”

Section: Finite Element Formulationsupporting

confidence: 89%

“…For the case of viscous fluid (K=0) and in the absence of buoyancy force (σ=0), the exact solution for f(η) subject to the boundary conditions as in equation (22) is given as follows where μ=(λ±λ2-4)/2, and is identical to that obtained by Fang and Zhang 16 with M=0 and by Yacob and Ishak 21 with K=0. The comparison of the flow velocity f'(η) obtained by FEM and by analytical method from equation (28) is tabulated in Table 2.…”

Section: Fem Solutionsmentioning

confidence: 83%

“…13 Shrinking sheet flows are important in the manufacture of certain polymers and high-performance materials for aerospace coatings, as documented by Baird and Baird. 15 Further discussions of shrinking sheet flows and their importance in the processing of various non-Newtonian materials have been provided by Zhong et al 16 for ceramic suspensions, Parng and Yang 17 for super-plastic polymeric sheets, Gupta and Ward 18 for thermal shrinking of polythene sheets, and Cheremisinoff 19 for viscoelastic membranes used in petroleum applications. Many theoretical and numerical studies of such flows have been reported.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Finite-element simulation of mixed convection flow of micropolar fluid over a shrinking sheet with thermal radiation

Gupta

Kumar

Bég³

et al. 2013

Proceedings of the Institution of Mechanical Engineers, Part E:

View full text Add to dashboard Cite

An analysis is carried out to investigate the effect of thermal radiation on mixed convection flow of a msicropolar fluid over a shrinking sheet with prescribed surface heat flux. The velocity of the shrinking sheet and the surface heat flux are assumed to vary as a linear function of the distance from the origin. Using the boundary layer approximation and similarity transformations, the governing partial differential equations are transformed into a system of nonlinear coupled ordinary differential equations which are solved numerically by using a variational finite element method. The effects of suction, radiation, and buoyancy parameters on velocity, microrotation, and temperature functions are examined in detail. The skin-friction coefficient, local couple stress, and the local Nusselt number have also been computed. Under special conditions, an analytical solution is obtained only for the flow velocity, which is compared with the numerical results obtained by finite element method. An excellent agreement of the two sets of solutions is observed, which confirms the validity of the finite element method employed herein. Also, in order to check the convergence of numerical solutions, the calculations are executed by reducing the mesh size. The sensitivity of the solution as a function of suction through the permeable sheet has also been examined. The current study has important applications in industrial polymeric materials processing.

show abstract

Section: Finite Element Formulationsupporting

confidence: 89%

Section: Fem Solutionsmentioning

confidence: 83%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Finite-element simulation of mixed convection flow of micropolar fluid over a shrinking sheet with thermal radiation

Gupta

Kumar

Bég³

et al. 2013

Proceedings of the Institution of Mechanical Engineers, Part E:

View full text Add to dashboard Cite

show abstract

“…Silicon nanowires may become crucial components for ultra‐low power devices (Pott and Ionescu, 2006). Precision manufacturing of silicon and advanced substrates also face more new challenges (Shankar and Zhong, 2006; Young et al , 2006; Zhong et al , 2006; Paehler et al , 2007; Schoenfelder et al , 2007).…”

Section: Introductionmentioning

confidence: 99%

Wire bonding of low‐k devices

Zhong

2008

Microelectronics International

View full text Add to dashboard Cite

If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to review recent advances in wire bonding of low-k devices. Design/methodology/approach -Dozens of journal and conference articles published in 2005-2008 are reviewed. Findings -The paper finds that many articles have discussed and analysed problems/challenges such as bond pad metal peeling/lift, non-sticking on pad, decreased bonding strength and lower wire-bond assembly yield. The paper discusses the articles' solutions to the problems and recent findings/ developments in wire bonding of low-k devices.Research limitations/implications -Because of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.Originality/value -The paper attempts to provide an introduction to recent developments and the trends in wire bonding of low-k devices. With the references provided, readers may explore more deeply by reading the original articles.

show abstract

“…Distributing reliable power, ground, data, address and other signals among IC chips and microelectronics devices through interconnections at such high speeds is a challenge (Kaushik et al , 2006). Precision machining/manufacturing of silicon, ceramic and polymer substrates (Zhong and Lee, 2001; Narasimhan, 2005; Zimmermann et al , 2005; Young et al , 2006; Zhong et al , 2006a; Schoenfelder et al , 2007), microelectronics packaging, and detection/analysis of various defects (Paehler et al , 2007) also face more and more new challenges.…”

Section: Introductionmentioning

confidence: 99%

Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging

Zhong

Tee²,

Luan³

2007

Microelectronics International

View full text Add to dashboard Cite

PurposeThis paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.Design/methodology/approachOf the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.FindingsResearch on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.Research limitations/implicationsBecause of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.Originality/valueThis review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.

show abstract

Effects of Sintering Process Conditions on Size Shrinkages of Low-Temperature Co-Fired Ceramic Substrate

Cited by 11 publications

References 18 publications

Finite-element simulation of mixed convection flow of micropolar fluid over a shrinking sheet with thermal radiation

Finite-element simulation of mixed convection flow of micropolar fluid over a shrinking sheet with thermal radiation

Wire bonding of low‐k devices

Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging

Contact Info

Product

Resources

About