Effects of RF Magnetron Sputtering Power on the Mechanical Behavior of Zr-Cu-Based Metallic Glass Thin Films

Nguyen, Tra Anh Khoa; Dang, Nhat Minh; Lin, Chi-Hang; Lee, Meng-Chieh; Wang, Zhao-Ying; Tsai, Yao-Chuan; Lin, Ming-Tzer

doi:10.3390/nano13192677

Cited by 3 publications

(1 citation statement)

References 88 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Metallic glass (MG) materials (or amorphous solids) usually possess ultra-high strength and hardness, due to their unique atomic structures lacking long-range orders, which prevents the initiation and motion of dislocations, as compared with their crystalline counterparts [ 1 , 2 , 3 , 4 , 5 , 6 ]. However, the lack of dislocation activities is the source of their near-zero plasticity since single shear banding-dominated deformation always generates catastrophic failure after the applied stress reaches the elastic limit of the material [ 7 , 8 , 9 , 10 ].…”

Section: Introductionmentioning

confidence: 99%

Quantifying the Size-Dependent Shear Banding Behavior in High-Entropy Alloy-Based Nanolayered Glass

Dai,

Zhang,

et al. 2024

Nanomaterials

View full text Add to dashboard Cite

Extensive research has shown that nanolayered structures are capable of suppressing the shear banding in metallic glass in nanoindentation experiments. However, the specific mode and mechanism of the shear banding underneath the indenter remains unknown. Also, the quantification of shear banding-induced strain localization is still a challenge. Herein, the size-dependent shear banding behavior of a CuTiZrNb high-entropy alloy-based nanolayered glass with individual layer thicknesses (h) ranging from 5 to 80 nm was systematically investigated by nanoindentation tests. It was found that the hardness of the designed structure was almost size-independent. Yet, a clear transition in the deformation modes from the cutting-like shear bands to the kinking-like ones was discovered as h decreased to 10 nm. Moreover, multiple secondary shear bands also appeared, in addition to the primary ones, in the sample with h = 10 nm. The transition leads to an obvious strain delocalization, as clearly illustrated by the proposed theoretical model, which is based on the assumption of a pure shear stress state to quantify the shear banding-induced strain localization. The strain delocalization results from the higher density of amorphous/amorphous interfaces that exhibit the change in morphology with a refined layered glass structure.

show abstract

Section: Introductionmentioning

confidence: 99%

Quantifying the Size-Dependent Shear Banding Behavior in High-Entropy Alloy-Based Nanolayered Glass

Dai,

Zhang,

et al. 2024

Nanomaterials

View full text Add to dashboard Cite

show abstract

FIB-DIC ring-core measurement of the residual stress on HiPIMS W/Cu and Cr/Cu multilayer thin films

Zeng,

Nguyen,

Dang

et al. 2024

Surface and Coatings Technology

View full text Add to dashboard Cite

Effect of sputtering power and thickness ratios on the materials properties of Cu–W and Cu–Cr bilayer thin films using high power impulse magnetron and DC magnetron sputtering

Nguyen,

Huang,

Dang

et al. 2024

Journal of Vacuum Science &Amp; Technology A

View full text Add to dashboard Cite

This study investigates the influence of Cu thickness ratios on the structural, morphological, and mechanical properties of sputtered Cu–W and Cu–Cr bilayer thin films. Employing high power impulse magnetron sputtering (HiPIMS), five distinct thickness ratios of 1:3, 3:5, 1:1, 5:3, and 3:1 were analyzed and compared to bilayer films developed using direct current magnetron sputtering (DCMS). The microstructural and surface characteristics of these films were evaluated using x-ray diffraction (XRD), atomic force microscopy, and scanning electron microscopy. Electrical properties were measured using a four-point probe, while mechanical properties were assessed through nanoindentation. Results reveal that increasing Cu thickness in Cu–W and Cu–Cr bilayers inversely affects hardness, grain size, and roughness, highlighting the influence of thickness ratios on film properties. Films with a higher Cu thickness ratio in both Cu–W and Cu–Cr bilayer systems deposited by HiPIMS exhibited lower hardness, smaller grain size, and reduced average roughness. Cross-sectional analysis and XRD confirmed the impact of thickness ratio on crystal phase and microstructure, indicating smoother columnar structures. Specifically, the HiPIMS-deposited Cu–Cr 3-1 film exhibited the lowest resistivity, at 4.77 μΩ cm, and hardness, measuring 8.26 GPa. Moreover, the 1:1 ratio films of Cu–W and Cu–Cr demonstrated hardness values of 13.81 and 11.37 GPa, respectively, which were 1.39 times higher than the films grown by DCMS. Additionally, variations in the bilayer thickness ratio significantly affected the electrical properties of the films. The enhanced properties of HiPIMS films are attributed to the higher peak power density of the target, leading to increased ion energy and deposition of dense grain structures.

show abstract

Effects of RF Magnetron Sputtering Power on the Mechanical Behavior of Zr-Cu-Based Metallic Glass Thin Films

Cited by 3 publications

References 88 publications

Quantifying the Size-Dependent Shear Banding Behavior in High-Entropy Alloy-Based Nanolayered Glass

Quantifying the Size-Dependent Shear Banding Behavior in High-Entropy Alloy-Based Nanolayered Glass

FIB-DIC ring-core measurement of the residual stress on HiPIMS W/Cu and Cr/Cu multilayer thin films

Effect of sputtering power and thickness ratios on the materials properties of Cu–W and Cu–Cr bilayer thin films using high power impulse magnetron and DC magnetron sputtering

Contact Info

Product

Resources

About