Effects of rare earths on properties and microstructures of lead-free solder alloys

Zhang, Liang; Xue, Songbai; Gao, Lili; Zeng, Guang; Su, Zhong Ming; Chen, Yan; Yu, Sirong

doi:10.1007/s10854-009-9895-2

Cited by 73 publications

(33 citation statements)

References 37 publications

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“…In this study, melting temperatures were evaluated by DSC measurement of enthalpy variation during the melting process. The onset point of the DSC heating curve is related to the solidus temperature and the peak point is recognized as the liquidus temperature of solder alloys [19]. Additionally, undercooling is defined as the temperature difference between the melting temperature of a solder alloy during heating and the solidification temperature during cooling.…”

Section: Resultsmentioning

confidence: 99%

Effects of cerium content on wettability, microstructure and mechanical properties of Sn–Ag–Ce solder alloys

Noh

Choi

Yoon

et al. 2010

Journal of Alloys and Compounds

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Section: Resultsmentioning

confidence: 99%

Effects of cerium content on wettability, microstructure and mechanical properties of Sn–Ag–Ce solder alloys

Noh

Choi

Yoon

et al. 2010

Journal of Alloys and Compounds

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“…These particles in the solder can hinder the lattice dislocation by blocking grain boundaries and form intermetallic compounds (IMCs) that have better characteristics, to make the grain finer and improve the resistant to thermal, mechanical and electrical stresses [6][7][8]. Metals, such as Ag, Au, Al, Ni, Cu, Cd, Zn, Mo and some rare-earth materials [9,10], and non-metallic materials, such as SiC, TiO 2 , Al 3 O 2 , carbon tube, graphen and even diamond [11][12][13][14][15], are studied as the doped particles to improve the mechanical properties of lead-free solder joints. According to these studies, there are two methods that are commonly used to add the reinforced particles into the solder.…”

Section: Introductionmentioning

confidence: 99%

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Sun

Chan

2014

J Mater Sci: Mater Electron

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Sn-Bi solder was proposed as one of the most promising substitutes for lead solder due to its lower melting temperature, good wettability, good yield strength and cost efficiency. With Ag elements added, the mechanical properties of Sn-Bi solder were improved obviously. There are two ways that are commonly used to add the reinforced particles into the solder. The first way (Way I) is to blend the reinforced particles with solder powders together, and then followed by pressure forming, sintering, cooling, crystallization and serious machining methods under inert atmosphere to make the solder paste. Another way (Way II) is to directly add the reinforced nano or micro particles into the solder paste by sufficient mechanical-stirring. In this research we would like to get fully understanding on the effects of these two ways of Ag addition on the mechanical properties of Sn-Bi-Ag solder joints during aging. Sn57.6Bi0.4Ag solder stands for the Way I and the doped Sn58Bi ? 0.4Ag solder stands for the Way II. These two kinds of joints were compared via micromorphology observation, thermal failure analyses as well as balls shear strength measurement after different aging time (under 100°C, from 0 to 800 h). The mechanical properties of Sn57.6Bi0.4Ag and the doped Sn58Bi ? 0.4Ag solder joints during aging were shown to be associated with the changes of micromorphology, the dissolution of IMCs, as well as the flatness of the joints' interface. Before long-time aging, the doped Sn58Bi ? 0.4Ag solder joints showed better mechanical performance than Sn57.6Bi0.4Ag solder joints. During aging, Sn56.7Bi0.4Ag solder joints had better performance in preventing the dissolution of Ni-Sn IMCs into the solder side, having smoother interfaces, comparing with Sn58Bi ? 0.4Ag solder joints. The degenerated phenomenon of Ag nanoparticle reinforcement seriously happened in the doped Sn58Bi ? 0.4Ag solder joints. After longtime aging, Sn57.6Bi0.4Ag solder joints had better mechanical properties than the doped Sn58Bi ? 0.4Ag solder joints.

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“…The use of solders has become indispensable for the interconnection and packaging of virtually all modern industrial electronic devices and circuits [1,2]. In recent years, environmental concerns, legislation, and even customer preferences are propelling the microelectronics industry towards implementation of lead-free solder alloys [3,4].…”

Section: Introductionmentioning

confidence: 99%

In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn–Cu solder alloys

Zhou

Kang

Cao

et al. 2014

J Mater Sci: Mater Electron

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The growth behavior of Cu 6 Sn 5 intermetallic compounds in rare earth (RE)-doped Sn-Cu solder alloys with an applied direct current (DC) has been in situ investigated using synchrotron radiation imaging technology. The morphological evolutions of Cu 6 Sn 5 with various shapes of I-like, Y-like and bird-like are directly observed. After doping RE, the number of I-like and bird-like Cu 6 Sn 5 is decreased, but the number of Y-like Cu 6 Sn 5 is increased. The morphologies of Cu 6 Sn 5 are more uniform and the mean lengths of Cu 6 Sn 5 of different shapes are reduced in RE-doped alloys compared with that in RE-free alloys, which is attributed to the adsorption effect of RE. The growth orientation of Y-like Cu 6 Sn 5 is changed after La is doped. Additionally, with an applied DC, the nucleation rate of Cu 6 Sn 5 is increased and the growth rate is markedly enhanced resulting in the refinement of Cu 6 Sn 5 . Furthermore, the mechanisms of refinement caused by RE and DC are specifically discussed.

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Effects of rare earths on properties and microstructures of lead-free solder alloys

Cited by 73 publications

References 37 publications

Effects of cerium content on wettability, microstructure and mechanical properties of Sn–Ag–Ce solder alloys

Effects of cerium content on wettability, microstructure and mechanical properties of Sn–Ag–Ce solder alloys

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn–Cu solder alloys

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