1997
DOI: 10.1016/s0040-6090(96)09038-4
|View full text |Cite
|
Sign up to set email alerts
|

Effects of r.f. bias and nitrogen flow rates on the reactive sputtering of TiA1N films

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

1
16
0

Year Published

2007
2007
2017
2017

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 52 publications
(17 citation statements)
references
References 34 publications
1
16
0
Order By: Relevance
“…When N 2 ratio increases to 100%, excessive nitrogen hinders the preferred growth of the coatings and induces the phase separation. This is because the nitrification of Al atoms initiates at higher nitrogen partial pressure [12].…”
Section: Methodsmentioning
confidence: 99%
“…When N 2 ratio increases to 100%, excessive nitrogen hinders the preferred growth of the coatings and induces the phase separation. This is because the nitrification of Al atoms initiates at higher nitrogen partial pressure [12].…”
Section: Methodsmentioning
confidence: 99%
“…The increase of the coating hardness with the increase of a negative substrate bias is usually followed by a decrease of adhesion strength due to the increase of residual stress. The optimum wear resistance of the TiAlN coating occurs at a higher substrate bias and nitrogen flow rate; however, after increasing the nitrogen flow rate further, the degraded wear resistance occurred [6]. The present study results show that the flank wear of the TiAlN-coated insert decreases with an increasing nitrogen flow rate.…”
Section: Resultsmentioning
confidence: 49%
“…Similar results were reported by other researchers. The hardness of the TiAlN coating increased with an increasing substrate bias due to the increase in the coating density [6,9]. The increase of the coating density is attributed to reducing the coating crystal size and the finer microstructure.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…According to the literature, the compact plane (111) originates sliding when stress is present, producing a low (cutting) strain. Another crystallographic referent is the plane (200) that theoretically contains the lowest energy in the case of materials with NaCl type structure [31]. As the bombardment energy increases, the Al atoms in the crystallographic lattice increase and also the plane (111) peak's intensity decreases rapidly.…”
mentioning
confidence: 99%