2022
DOI: 10.1016/j.diamond.2022.108899
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Effects of polishing pressure and sliding speed on the material removal mechanism of single crystal diamond in plasma-assisted polishing

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Cited by 23 publications
(5 citation statements)
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“…While PAP exhibits potential as an effective and safe technique for the machining of SCD substrates, the significance of the sliding speed and polishing pressure in the material removal process remains uncertain. Addressing this, N. Liu et al investigated the impact of the pressure and sliding speed on diamond material removal during PAP polishing [111]. Their findings revealed that higher polishing pressure or sliding speeds between the polished plate and substrate could enhance the MRR, and controlled pressure classification could yield an ultra-smooth surface devoid of a damaged layer, achieving final surface roughness of 0.3 nm, with an MRR reaching as high as 5.3 µm/h.…”
Section: Plasma Polishingmentioning
confidence: 99%
“…While PAP exhibits potential as an effective and safe technique for the machining of SCD substrates, the significance of the sliding speed and polishing pressure in the material removal process remains uncertain. Addressing this, N. Liu et al investigated the impact of the pressure and sliding speed on diamond material removal during PAP polishing [111]. Their findings revealed that higher polishing pressure or sliding speeds between the polished plate and substrate could enhance the MRR, and controlled pressure classification could yield an ultra-smooth surface devoid of a damaged layer, achieving final surface roughness of 0.3 nm, with an MRR reaching as high as 5.3 µm/h.…”
Section: Plasma Polishingmentioning
confidence: 99%
“…In 2011, Yamamura et al [118] proposed the PAP method for SCD surfaces. Liu et al [119] fabricated a device for PAP of SCD, as shown in figures 8(a) and (b). The device creates Ar-based plasma through the radio frequency electric field between the upper electrode and the lower rotating disc and polishes diamond through the chemical and mechanical action between the polishing disc and the substrate under the assistance of plasma.…”
Section: Papmentioning
confidence: 99%
“…Currently, PAP is only successfully used for polishing SCD substrates. In [46,51,119,120], Ar-based oxygen plasma was selected for the PAP of diamond. The polishing accuracy of PAP is extremely high, and [46] the surface roughness Sq of the polished SCD surface is below 0.5 nm, with a maximum MRR of 13.3 µm h −1 .…”
Section: Papmentioning
confidence: 99%
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“…Diamond devices are fabricated using plasma and thermochemical methods. , Recently, a plasma-assisted quartz polishing of diamond that produces atomically smooth and damage-free surfaces has been developed. , While these methods were able to produce precise and high-quality diamond components and devices, their efficiency is still lower compared to the methods used in the fabrication of conventional materials like silicon. All of these methods fundamentally involve diamond oxidation reaction.…”
Section: Introductionmentioning
confidence: 99%