Effects of polishing, etching, cleaving, and water leaching on the UV laser damage of fused silica

Yoshiyama, J. M.; Génin, François Y.; Salleo, Alberto; Thomas, Ian M.; Kozlowski, Mark R.; Sheehan, Lynn Matthew; Hutcheon, I. D.; Camp, David W.

doi:10.1117/12.307041

Cited by 31 publications

(20 citation statements)

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“…The pattern of pit damage observed in this work is similar to patterns of single-shot UV laser damage observed by Yoshiyama et al [10] on polished fused silica; much of this damage could be eliminated by etching the polished surface to remove the 100-200 nm surface layer altered by polishing. In optical applications, a chemical etch is not acceptable; thus the effect of polishing on optical damage must be understood.…”

Section: à2supporting

confidence: 85%

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The onset of optical breakdown in KrF-laser-irradiated silica glass surfaces

Kawaguchi

Narazaki

Sato

et al. 2002

Applied Surface Science

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We have investigated the onset of surface optical breakdown on a polished, synthetic silica glass under KrF excimer laser irradiation. With increasing laser fluence, a transient, localized luminescence is often observed. If the fluence is increased further, the luminescence reappears and grows gradually more intense with continued exposure. Subsequent examination of damaged surfaces show small craters, about 1 mm in diameter, in the damaged region. Surfaces damaged by single laser pulses at still higher fluences show similar morphologies, suggesting that the same defects or flaws are responsible for damage under multiple pulse and single pulse conditions. #

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Section: à2supporting

confidence: 85%

“…Thus it is important to clarify the mechanisms of optical breakdown in these materials. Fused silica is widely used for optical components, and its interaction with UV laser photons has attracted much interest [2][3][4][5][6][7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

The onset of optical breakdown in KrF-laser-irradiated silica glass surfaces

Kawaguchi

Narazaki

Sato

et al. 2002

Applied Surface Science

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“…al. [9] showed that removal of up to 200 nm from the silica surface resulted in an increase in the damage threshold. Battersby et.…”

Section: Introductionmentioning

confidence: 99%

HF‐Based Etching Processes for Improving Laser Damage Resistance of Fused Silica Optical Surfaces

Suratwala

Miller

Bude

et al. 2010

Journal of the American Ceramic Society

224

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The effect of various HF‐based etching processes on the laser damage resistance of scratched fused silica surfaces has been investigated. Conventionally polished and subsequently scratched fused silica plates were treated by submerging in various HF‐based etchants (HF or NH4F:HF at various ratios and concentrations) under different process conditions (e.g., agitation frequencies, etch times, rinse conditions, and environmental cleanliness). Subsequently, the laser damage resistance (at 351 or 355 nm) of the treated surface was measured. The laser damage resistance was found to be strongly process dependent and scaled inversely with scratch width. The etching process was optimized to remove or prevent the presence of identified precursors (chemical impurities, fracture surfaces, and silica‐based redeposit) known to lead to laser damage initiation. The redeposit precursor was reduced (and hence the damage threshold was increased) by: (1) increasing the SiF62− solubility through reduction in the NH4F concentration and impurity cation impurities, and (2) improving the mass transport of reaction product (SiF62−) (using high‐frequency ultrasonic agitation and excessive spray rinsing) away from the etched surface. A 2D finite element crack‐etching and rinsing mass transport model (incorporating diffusion and advection) was used to predict reaction product concentration. The predictions are consistent with the experimentally observed process trends. The laser damage thresholds also increased with etched amount (up to ∼30 μm), which has been attributed to: (1) etching through lateral cracks where there is poor acid penetration, and (2) increasing the crack opening resulting in increased mass transport rates. With the optimized etch process, laser damage resistance increased dramatically; the average threshold fluence for damage initiation for 30 μm wide scratches increased from 7 to 41 J/cm2, and the statistical probability of damage initiation at 12 J/cm2 of an ensemble of scratches decreased from ∼100 mm−1 of scratch length to ∼0.001 mm−1.

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“…The 5 µm bulk damage core [2,5] can be seen at the center of the crater with the surrounding radially propagating crack structure both of which are distinct of a bulk damage surface eruption [7]. The "Pits" are very similar to grey haze [2,15] initiated on fused silica surfaces due to their small diameter (~1 µm) and apparent circular shape and the "Chips", too, are very similar in morphology to typical surface damage initiated on fused silica in the 30 µm range [1-3]. Figure 9: Examples of the four distinct output surface damage morphologies initiated by the 15 J/cm 2 test shot on the 4 J/cm 2 500 ps conditioned region of the crystal.…”

Section: Morphology and Size Distribution For The Output Surface Damamentioning

confidence: 99%

Analysis of output surface damage resulting from single 351 nm, 3 ns pulses on sub-nanosecond laser conditioned KD 2 PO 4 crystals

2007

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We observe that by conditioning DKDP using 500 ps laser pulses, the bulk damage threshold becomes essentially equivalent to the surface damage threshold. We report here the findings of our study of laser initiated output surface damage on 500 ps laser conditioned DKDP for test pulses at 351 nm, 3 ns. The relation between surface damage density and damaging fluence (ρ(φ)) is presented for the first time and the morphologies of the surface sites are discussed. The results of this study suggest a surface conditioning effect resulting from exposure to 500 ps laser pulses.

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Effects of polishing, etching, cleaving, and water leaching on the UV laser damage of fused silica

Cited by 31 publications

References 0 publications

The onset of optical breakdown in KrF-laser-irradiated silica glass surfaces

The onset of optical breakdown in KrF-laser-irradiated silica glass surfaces

HF‐Based Etching Processes for Improving Laser Damage Resistance of Fused Silica Optical Surfaces

Analysis of output surface damage resulting from single 351 nm, 3 ns pulses on sub-nanosecond laser conditioned KD 2 PO 4 crystals

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