Effects of plasma treatment of polyimide on the adhesion strength of epoxy resin / polyimide j oints

Yun, H.K.; Cho, K.; Kim, J.K.; Park, C.E.; Sim, Sung-min; Oh, Sehoon; Park, J.M.

doi:10.1163/156856197x01038

Cited by 35 publications

(10 citation statements)

References 11 publications

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“…It was found that chain scission [59,68,69] accompanied by oxidative attack leads to the formation of low molecular weight oxidized material which agglomerated into globules at the surface. Such low molecular weight fragments of the polymer at the surface acted as a weak boundary layer.…”

Section: Oxidation Mechanism By Flame Treatmentmentioning

confidence: 99%

Flame treatment of low-density polyethylene: Surface chemistry across the length scales

Song¹,

Gunst

Arlinghaus

et al. 2007

Applied Surface Science

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The relationship between surface chemistry and morphology of flame treated low-density polyethylene (LDPE) was studied by various characterization techniques across different length scales. The chemical composition of the surface was determined on the micrometer scale by Xray photoelectron spectroscopy (XPS) as well as with time of flight secondary ion mass spectrometry (ToF-SIMS), while surface wettability was obtained through contact angle (CA) measurements on the millimeter scale. The surface concentration of hydroxyl, carbonyl and carboxyl groups, as a function of the ''number'' of the flame treatment passes (which is proportional to the treatment time) was obtained. Moreover, a correlation was found with chemical composition and polarity, emphasizing the role of oxygen-containing functional groups introduced during the treatment. Carboxyl functional groups were specifically identified by fluorescent labeling and the results were compared with the ToF-SIMS data. In addition, atomic force microscopy (AFM) was used to evaluate changes in surface topography and roughness on the nanometer to micrometer length scales. After flame treatment, water-soluble low molecular weight oxidized materials (LMWOM), which were generated as products of oxidation and chain scission of the LDPE surface, agglomerated into small topographical mounds that were visible in the AFM micrographs. After rinsing the flame treated samples with water and ethanol, bead-like nodular surface structures were observed. The ionization state of flame treated LDPE surfaces was monitored by chemical force microscopy (CFM). The effective surface pK a values of carboxylic acid (-COOH) obtained by AFM were revealed by chemical force titration curves and the effective surface pK a values were found to be around 6. #

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Section: Oxidation Mechanism By Flame Treatmentmentioning

confidence: 99%

Flame treatment of low-density polyethylene: Surface chemistry across the length scales

Song¹,

Gunst

Arlinghaus

et al. 2007

Applied Surface Science

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“…11,12 The base PI film is covered by a thin adhesive layer, which is now acting as a barrier layer between the PI and the ACF. As this adhesive is already cured during Cu lamination and passes through additional process (e.g., Cu etching, dry film stripping, rinsing, etc.)…”

Section: Discussionmentioning

confidence: 99%

Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film

Uddin

Alam

Chan

et al. 2003

Journal of Elec Materi

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Advanced integrated circuit packaging processes require good bondability and reliability between various mating surfaces. A key factor affecting this requirement is surface cleanliness. Plasma cleaning is the most suitable process for optimum surface cleanliness. An investigation of O 2 , Ar, and O 2 /SF 6 plasma cleaning was carried out on a flexible substrate to study the adhesion of anisotropic conductive adhesive film for flip chip bonding. Surface roughness was found to increase substantially after the plasma treatment. Adhesion strength was evaluated by 90º peeling tests both for untreated and plasmatreated flex. A higher adhesion strength of anisotropic conductive film (ACF) bond was observed after plasma cleaning. The surface morphology of plasma treated and untreated flex substrate before bonding, as well as the fracture surfaces after the peel test for both cases, was characterized by secondary electron image techniques of scanning electron microscopy (SEM). Based on the detailed SEM findings, extensive comparisons were made between the plasma treated and the untreated samples. Mechanical interlocking is found to be responsible for higher peel strength of the plasma treated flex bonding. It was also proposed to select the right flexible substrate for highly reliable, ACF bonded flip chip on flex substrate.

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“…Gonzalez and Hicks [13] have investigated the surface modifications of polymers after remote APPT, while Zaldivar et al [14] have used APPT to improve the strength of composites. Additionally, Yun et al [15] have studied how the APPT affects polyimide/novolac epoxy resin joints using various gas types and aging temperatures. However, few studies exist on the mechanism of activating SMC substrates by APPT.…”

Section: Introductionmentioning

confidence: 99%

Effect of Atmospheric Pressure Plasma Treatment on the Lap-Shear Strength of Adhesive-Bonded Sheet Molding Compound Joints

et al. 2018

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Atmospheric pressure plasma treatment (APPT) technology was used herein to treat sheet molding compound (SMC) substrates to increase the lap-shear strength of adhesive-bonded SMC joints. Further, the mechanisms behind the lap-shear strength improvements in APPT-treated adhesive-bonded SMC joints were explored. A maximum lap-shear strength about three times that of the as-received SMC joints was achieved when the APPT distance was set to 20 mm. The surface roughness, which exhibited little benefit to the lap-shear strength, was determined to not be the primary reason for the increase in lap-shear strength. Specifically, X-ray photoelectron spectra revealed that an increased amount of O-containing groups (i.e., C-O-H, C-O-C, H-O-C=O or R-O-C=O) following APPT contributed to the improved lap-shear strength. In addition, the surface free energy increased significantly after APPT, which improved the lap-shear strength of the adhesive-bonded SMC joints. Compared to the change of surface morphology, the changes in both the surface chemical property and surface free energy played larger roles in increasing the lap-shear strength of APPT-treated SMC joints.

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Effects of plasma treatment of polyimide on the adhesion strength of epoxy resin / polyimide j oints

Cited by 35 publications

References 11 publications

Flame treatment of low-density polyethylene: Surface chemistry across the length scales

Flame treatment of low-density polyethylene: Surface chemistry across the length scales

Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film

Effect of Atmospheric Pressure Plasma Treatment on the Lap-Shear Strength of Adhesive-Bonded Sheet Molding Compound Joints

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