Effects of Packaging Materials on the Reliability of System in Package

Gao, Shan; Hong, Jimin; Kim, Jinsu; Choi, Sang‐Hoon; Yi, Sung

doi:10.1109/icept.2007.4441427

Cited by 12 publications

(3 citation statements)

References 9 publications

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“…Thus, size and distribution of these fillers in the EMC affect the mechanical properties of the EMC [11]. It was shown that a smaller filler size might improve the reliability of the package [12]. Wafer warpage after molding and EMC curing is a result of mismatched coefficients of thermal expansion (CTE) and of shrinkage caused by curing.…”

Section: Introductionmentioning

confidence: 99%

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Determination of the Filler Distribution in an Epoxy Molding Compound Using High-Resolution X-Ray Computed Tomography

Topal

Gluch

Clausner

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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In this paper, the filler distribution in an epoxy molding compound (EMC), used in IC packaging, is studied across a wafer using high-resolution X-ray computed tomography (HR-XCT). It is widely assumed that the fillers are uniformly distributed across the wafer. However, it is demonstrated that the distribution of the filler deviates across the wafer, and that filler sizes affect the distribution on edge and center of wafer too. Quantitative HR-XCT of the filler distribution provides accurate data for simulation. Based on this approach, the differences between CTE and Young's modulus values of the filler material for the center and edge of the wafer is explained. Furthermore, compression simulations are conducted applying an XCT-based FEM model to understand the role of EMC for the mechanical behavior of advanced IC packages. These findings are validated by in-situ and stand-alone compression experiments. The accurate simulation results demonstrate that the use of an XCT-based FEM model provides insight into the mechanical behavior of the EMC itself, and furthermore, of the whole IC package.

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Section: Introductionmentioning

confidence: 99%

“…The FEM simulation is a commonly used approach to understand the dynamic warpage behavior of the package, particularly to accurately predict the package warpage and to refine the process and design parameters [12]. Therefore, it is critical to consider the process-dependent constitutive behaviors of the packaging materials.…”

Section: Introductionmentioning

confidence: 99%

Determination of the Filler Distribution in an Epoxy Molding Compound Using High-Resolution X-Ray Computed Tomography

Topal

Gluch

Clausner

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Ces différences de CTE conduisent, lors de contraintes thermiques à du gauchissement et de la délamination. Ce qui peut amener des mécanismes de défaillances tels que des puces cassées ou des joints de brasures fissurés [4]. En deuxième lieu vient l'absorption d'humidité par le boîtier.…”

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Fast reliability qualification of SiP products

Regard

Gautier

Frémont

et al. 2009

Microelectronics Reliability

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NXP Semiconductor at Caen, which has System in Package (SiP) technologies development competences and NXP Semiconductor at Eindhoven, which has virtual qualification specialization jointed to study fast reliability qualification of SiP products. A thesis focused on simulations started at TU Delft University (Netherlands) with Xiaosong Ma directed by Kaspar Jansen and another thesis focused on experimentation started at Bordeaux 1 University with Charles Regard directed by Hélène Frémont. These thesis were lead on close collaboration. In a first time, the tests vehicles were defined by both the PhD students. Then materials characterizations and simulations were performed at TU Delft, and experimental qualification tests and physical analyses were performed in Caen. A long of these thesis, constant exchanges allowed to correlate simulations by experimentation. This industrial need of SiP product qualification study is due to the strong increase of functions integration into mobile equipments. Thus the SiP technology allows to provide in relative short time miniaturized products imposed by the new developments. This thesis work's goal is to get methods and techniques to optimize System in Package (SiP) reliability qualification.

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