Effects of package on the performance of MEMS piezoresistive accelerometers

Li, Ping; Gao, Shiqiao; Liu, Haipeng; Li, Jun; Shi, Yunbo

doi:10.1007/s00542-012-1711-x

Cited by 12 publications

(5 citation statements)

References 23 publications

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“…Then, as a stress-based transduction device, the residual stresses from the chip fabrication process [39,40], wafer bonding [41], adhesion and compound molding [42,43] can lead to obvious variations in sensor parameters. Meantime, the difference of coefficient of thermal expansion (CTE) between the materials will induce a significant accompanying stress in the device, and the effect varies under different ambient temperatures for different sensors [44,45,46]. …”

Section: Introductionmentioning

confidence: 99%

Thermal-Performance Instability in Piezoresistive Sensors: Inducement and Improvement

Liu

Wang

Zhao

et al. 2016

Sensors

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The field of piezoresistive sensors has been undergoing a significant revolution in terms of design methodology, material technology and micromachining process. However, the temperature dependence of sensor characteristics remains a hurdle to cross. This review focuses on the issues in thermal-performance instability of piezoresistive sensors. Based on the operation fundamental, inducements to the instability are investigated in detail and correspondingly available ameliorative methods are presented. Pros and cons of each improvement approach are also summarized. Though several schemes have been proposed and put into reality with favorable achievements, the schemes featuring simple implementation and excellent compatibility with existing techniques are still emergently demanded to construct a piezoresistive sensor with excellent comprehensive performance.

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Section: Introductionmentioning

confidence: 99%

Thermal-Performance Instability in Piezoresistive Sensors: Inducement and Improvement

Liu

Wang

Zhao

et al. 2016

Sensors

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“…Li et al found through theoretical analysis and simulation tests that the die adhesive dosage is inversely proportional to the sensitivity during packaging, and the binder thickness is inversely proportional to the residual stress after packaging. Uniform binder dosage and thickness with a suitable potting adhesive can ensure the consistency and improvement in device sensitivity [151].…”

Section: Process Of Mems Sensorsmentioning

confidence: 99%

A Review of Flexible Acceleration Sensors Based on Piezoelectric Materials: Performance Characterization, Parametric Analysis, Frontier Technologies, and Applications

et al. 2023

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Acceleration sensors are tools for detecting acceleration and serve purposes like fault monitoring and behavior recognition. It is extensively employed in a variety of industries, including aerospace, artificial intelligence, biology, and many more. Among these, one of the major research hotspots and challenges is the development of low-energy, self-powered, miniature, mass-produced sensors. Due to its capacity to perceive human behavior and identify errors, the flexible acceleration sensor offers a distinct advantage in the use of flexible and miniaturized sensing systems. This review analyzes the current state of piezoelectric flexible acceleration sensors’ applications in the areas of sensitive materials, processing technology, and device structure and briefly summarizes the fundamental properties of these sensors. Additionally, it ends with a prognosis for the future growth of flexible piezoelectric acceleration sensors.

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“…Finite element analysis (FEA) has been extensively used to predict the stress distribution in MEMS and microresonators [14], [19], [20]. [21] 3-point bending…”

Section: Residual Stresses and Their Analysis By Hrxrdmentioning

confidence: 99%

Mechanical properties of MEMS materials: reliability investigations by mechanical- and HRXRD-characterization related to environmental testing

2014

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The performance and aging of MEMS often rely on the stability of the mechanical properties over time and under harsh conditions. An overview is given on methods to investigate small variations of the mechanical properties of structural MEMS materials by functional characterization, high-resolution x-ray diffraction methods (HR-XRD) and environmental testing. The measurement of the dynamical properties of micro-resonators is a powerful method for the investigation of elasticity variations in structures relevant to microtechnology. X-ray diffraction techniques are used to analyze residual strains and deformations with high accuracy and in a non-destructive manner at surfaces and in buried micro-structures. The influence of elevated temperatures and radiation damage on the performance of resonant microstructures with a focus on quartz and single crystal silicon is discussed and illustrated with examples including work done in our laboratories at CSEM and EPFL.

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Effects of package on the performance of MEMS piezoresistive accelerometers

Cited by 12 publications

References 23 publications

Thermal-Performance Instability in Piezoresistive Sensors: Inducement and Improvement

Thermal-Performance Instability in Piezoresistive Sensors: Inducement and Improvement

A Review of Flexible Acceleration Sensors Based on Piezoelectric Materials: Performance Characterization, Parametric Analysis, Frontier Technologies, and Applications

Mechanical properties of MEMS materials: reliability investigations by mechanical- and HRXRD-characterization related to environmental testing

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