“…For instances, in fabrication and packaging the microelectronics, especially in integrated circuits (ICs) and mechanical/electrical micro systems (MEMSs), copper thin films as the excellent conductors are extensively used. So far, for fabrication of thin films on various substrates, several methods such as chemical vapor deposition (CVD), sol-gel, pulsedlaser deposition, electro-deposition, magnetron sputtering of a target, wet chemical routes and other methods were used [11][12][13][14][15][16][17]. It is well known that the surface properties such as adhesion, wettability, surface reactivity and catalytic activity are related to the development of a homogeneous thin film on the base material surface.…”