Effects of organic additives on electroplated soft magnetic CoFeCr films

Lallemand, Fabrice; Comte, Damien; Ricq, Laurence; Renaux, P.; Pagetti, J.; Dieppedale, C.; Gaud, P.

doi:10.1016/j.apsusc.2003.09.033

Cited by 28 publications

(13 citation statements)

References 21 publications

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“…The negative shift of potential at J = 4 A dm )2 increases in the following order: guanidin, urea and thiourea. An increase in the metal deposition potential has been observed in the presence of additives [23][24][25][26]. This result is usually interpreted in terms of partial coverage of the electrode surface by the additive.…”

Section: Morphology and Texture Of Zinc Depositsmentioning

confidence: 97%

Effects of some additives on the corrosion behaviour and preferred orientations of zinc obtained by continuous current deposition

et al. 2006

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The effect of thiourea, urea and guanidin on zinc deposits obtained from chloride baths under continuous current conditions are described and discussed. The corrosion behaviour of the deposits was investigated in an aerated 3.5% NaCl solution; anodic polarization curves, polarization resistance (R p ) measurements and weight-loss studies were performed. The corrosion resistance of zinc deposits improved in the presence of urea. The deposit morphology was analyzed using Scanning Electron Microscopy (SEM) and X-Ray Diffraction (XRD) was used to determine the preferred crystallographic orientations of the deposits. The preferred crystallographic orientations of zinc deposits (112) do not change in the presence of urea and guanidin except for an increase in the peak intensity of the (112) plane. In the presence of thiourea, zinc deposits crystallise in two textures; (100) and (110). The influence of each additive and the difference between additives on the zinc deposits are also discussed.

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Section: Morphology and Texture Of Zinc Depositsmentioning

confidence: 97%

Effects of some additives on the corrosion behaviour and preferred orientations of zinc obtained by continuous current deposition

et al. 2006

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“…This shows that thiourea affects the deposition of cobalt. The shift to more negative potential has been observed in the presence of additives [33][34][35][36]. Adsorption of the additive molecules on the growing deposits has an impact on the nucleation rate and nucleation mechanism.…”

Section: Voltammetric Studiesmentioning

confidence: 98%

Effects of thiourea and urea on zinc–cobalt electrodeposition under continuous current

2007

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The effect of thiourea and urea on zinc-cobalt alloys obtained from chloride baths under continuous current deposition are described and discussed. The deposit morphology was analyzed using Scanning Electron Microscopy (SEM) and an X-Ray Diffraction (XRD) was used to determine the preferred crystallographic orientations of the deposits. The use of additives does not refine the grain size of the Zn-Co alloy and an especially porous alloy was produced in the presence of urea. The preferred crystallographic orientations of zinc-cobalt alloys do not change in the presence additives. Zinc-cobalt alloys were without texture in the presence and absence of additives. Also, in the absence of additive and in the presence of urea, the XRD lines of the Zn-Co alloys are slightly shifted with respect to the pure zinc XRD lines, whereas, in the presence of thiourea, the XRD lines are not shifted. The alloy composition was examined using Energy Dispersive X-ray Fluorescence Spectroscopy (EDXRF). The percentage of cobalt in the alloy decreases slightly from 1.04 to 0.91 wt.% in the presence of urea and in the presence of thiourea it increases from 1.04 to 7.70 wt.%. Voltammetric studies show that thiourea increases the reduction rate of cobalt. This explains the increase in cobalt percentage in the alloy in the presence of thiourea.

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“…8(b)), grain size increases (0.5 m), the total charge transfered is 78 mC cm −2 , but grain shape is the same as for the additive free copper. It should be noted that saccharin is usually used as a brightener for electrodeposition of other metals or alloys such as nickel [41,55], cobalt-iron [56,57], and Cu-Ni or Cu-Co. In these cases, saccharin exhibits a strong influence on the microstructure i.e.…”

Section: Microscopic Studiesmentioning

confidence: 99%

Influence of organic additives on the initial stages of copper electrodeposition on polycrystalline platinum

Quinet

Lallemand

Ricq

et al. 2009

Electrochimica Acta

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Effects of organic additives on electroplated soft magnetic CoFeCr films

Cited by 28 publications

References 21 publications

Effects of some additives on the corrosion behaviour and preferred orientations of zinc obtained by continuous current deposition

Effects of some additives on the corrosion behaviour and preferred orientations of zinc obtained by continuous current deposition

Effects of thiourea and urea on zinc–cobalt electrodeposition under continuous current

Influence of organic additives on the initial stages of copper electrodeposition on polycrystalline platinum

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